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公开(公告)号：US08731671B2
公开(公告)日：2014-05-20
申请号：US13207811
申请日：2011-08-11
IPC分类号： A61N1/375
CPC分类号： A61N1/3752 , H01R13/187 , H01R2201/12
摘要： An implantable medical device includes a housing, a header mounted to the housing, the header including a header body having a bore with an electrical contact located within the bore, wherein the electrical contact includes a plurality of contact points, wherein at least two of the contact points are longitudinally offset from each other along the bore.
摘要翻译： 可植入医疗装置包括壳体，安装到壳体的头部，头部包括具有位于孔内的电触头的孔的集管主体，其中电触点包括多个接触点，其中至少两个 接触点沿着孔彼此纵向偏移。
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公开(公告)号：US20120053663A1
公开(公告)日：2012-03-01
申请号：US13207811
申请日：2011-08-11
CPC分类号： A61N1/3752 , H01R13/187 , H01R2201/12
摘要： An implantable medical device includes a housing, a header mounted to the housing, the header including a header body having a bore with an electrical contact located within the bore, wherein the electrical contact includes a plurality of contact points, wherein at least two of the contact points are longitudinally offset from each other along the bore.
摘要翻译： 可植入医疗装置包括壳体，安装到壳体的头部，头部包括具有位于孔内的电触头的孔的集管主体，其中电触点包括多个接触点，其中至少两个 接触点沿着孔彼此纵向偏移。
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公开(公告)号：US08954150B2
公开(公告)日：2015-02-10
申请号：US12878406
申请日：2010-09-09
CPC分类号： A61N1/3754 , A61N1/3758 , Y10T29/49002
摘要： The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.
摘要翻译： 本主题提供了用于制造具有主电路板的可植入医疗装置的部件的装置的装置和方法。 该方法包括在外壳的外侧上形成包围孔。 外壳的侧面适于基本上平行于主电路板的表面放置。 馈通组件通过封装孔连接。 馈通组件包括至少一个端部导体，至少部分穿过封装孔。
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4.发明申请APPARATUS AND METHOD FOR ATTACHING A HEADER TO A HOUSING OF AN IMPLANTABLE DEVICE 有权用于将头部连接到可移植装置的壳体的装置和方法公开(公告)号：US20120052710A1
公开(公告)日：2012-03-01
申请号：US13207918
申请日：2011-08-11
申请人： Mark G. Deehr , Michael J. Kloosterboer , Blair Erbstoeszer , David A. Chizek , Mee S. Burckhardt , Noel Doherty , John M. Edgell , Lawrence D. Swanson , John E. Hansen
发明人： Mark G. Deehr , Michael J. Kloosterboer , Blair Erbstoeszer , David A. Chizek , Mee S. Burckhardt , Noel Doherty , John M. Edgell , Lawrence D. Swanson , John E. Hansen
IPC分类号： H01R13/625 , H01R43/16
CPC分类号： A61N1/375 , F16B21/186 , F16B37/02 , F16B37/0842 , F16B43/00
摘要： An apparatus includes an implantable housing, a header including a cavity, a post extending from a surface of the housing into the cavity, the post including an expanded head portion, and a retaining member mounted within the header and engaged with the post with a bottom surface of the retaining member abutting an internal surface of the header.
摘要翻译： 一种装置包括可植入壳体，头部包括空腔，从壳体的表面延伸到空腔中的柱，柱包括扩大的头部，以及保持构件，其安装在集管内并与底部接合 保持构件的表面邻接头部的内表面。
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公开(公告)号：US20110082531A1
公开(公告)日：2011-04-07
申请号：US12878406
申请日：2010-09-09
CPC分类号： A61N1/3754 , A61N1/3758 , Y10T29/49002
摘要： The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.
摘要翻译： 本主题提供了用于制造具有主电路板的可植入医疗装置的部件的装置的装置和方法。 该方法包括在外壳的外侧上形成包围孔。 外壳的侧面适于基本上平行于主电路板的表面放置。 馈通组件通过封装孔连接。 馈通组件包括至少一个端部导体，至少部分穿过封装孔。
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6.发明授权Apparatus and method for attaching a header to a housing of an implantable device 有权用于将头部附接到可植入装置的壳体的装置和方法公开(公告)号：US08585445B2
公开(公告)日：2013-11-19
申请号：US13207918
申请日：2011-08-11
申请人： Mark G. Deehr , Michael J. Kloosterboer , Blair Erbstoeszer , David A. Chizek , Mee S. Burckhardt , Noel Doherty , John M. Edgell , Lawrence D. Swanson , John E. Hansen
发明人： Mark G. Deehr , Michael J. Kloosterboer , Blair Erbstoeszer , David A. Chizek , Mee S. Burckhardt , Noel Doherty , John M. Edgell , Lawrence D. Swanson , John E. Hansen
IPC分类号： H01R13/625
CPC分类号： A61N1/375 , F16B21/186 , F16B37/02 , F16B37/0842 , F16B43/00
摘要： An apparatus includes an implantable housing, a header including a cavity, a post extending from a surface of the housing into the cavity, the post including an expanded head portion, and a retaining member mounted within the header and engaged with the post with a bottom surface of the retaining member abutting an internal surface of the header.
摘要翻译： 一种装置包括可植入壳体，头部包括空腔，从壳体的表面延伸到空腔中的柱，柱包括扩大的头部，以及保持构件，其安装在集管内并与底部接合 保持构件的表面邻接头部的内表面。
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公开(公告)号：US20120130206A1
公开(公告)日：2012-05-24
申请号：US13302282
申请日：2011-11-22
CPC分类号： A61N1/37229 , A61B5/0031 , H01Q1/273 , H01Q1/36 , H01Q9/0414 , Y10T29/49016
摘要： Subject matter such as a method or apparatus can include an implantable antenna assembly, comprising a dielectric shell including first and second substantially parallel outer face portions, and a third outer face portion extending between the first and second portions, a spiral conductor extending along the first, second, and third portions on a surface of the dielectric shell. The dielectric shell and spiral conductor can be configured to be mechanically attached to a dielectric compartment, such as configured to be coupled to a housing of an implantable medical device. In an example, the implantable antenna assembly is configured to be electrically coupled to an implantable telemetry circuit configured to wirelessly transfer information electromagnetically using the implantable telemetry antenna, such as included as a portion of an implantable medical device.
摘要翻译： 诸如方法或装置的主题可以包括可植入天线组件，其包括包括第一和第二基本平行的外表面部分的介电壳，以及在第一和第二部分之间延伸的第三外表面部分，沿着第一和第二部分延伸的螺旋导体 ，第二和第三部分在介电壳的表面上。 电介质外壳和螺旋导体可以被配置为机械地附接到电介质隔室，例如被配置为联接到可植入医疗装置的壳体。 在一个示例中，可植入天线组件被配置为电耦合到可植入遥测电路，该可植入遥测电路被配置为使用可植入遥测天线以电磁方式无线地传送信息，诸如被包括为可植入医疗设备的一部分。
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公开(公告)号：US09579509B2
公开(公告)日：2017-02-28
申请号：US13302282
申请日：2011-11-22
CPC分类号： A61N1/37229 , A61B5/0031 , H01Q1/273 , H01Q1/36 , H01Q9/0414 , Y10T29/49016
摘要： Subject matter such as a method or apparatus can include an implantable antenna assembly, comprising a dielectric shell including first and second substantially parallel outer face portions, and a third outer face portion extending between the first and second portions, a spiral conductor extending along the first, second, and third portions on a surface of the dielectric shell. The dielectric shell and spiral conductor can be configured to be mechanically attached to a dielectric compartment, such as configured to be coupled to a housing of an implantable medical device. In an example, the implantable antenna assembly is configured to be electrically coupled to an implantable telemetry circuit configured to wirelessly transfer information electromagnetically using the implantable telemetry antenna, such as included as a portion of an implantable medical device.
摘要翻译： 诸如方法或装置的主题可以包括可植入天线组件，其包括包括第一和第二基本平行的外表面部分的介电壳，以及在第一和第二部分之间延伸的第三外表面部分，沿着第一和第二部分延伸的螺旋导体 ，第二和第三部分在介电壳的表面上。 电介质外壳和螺旋导体可以被配置为机械地附接到电介质隔室，例如被配置为联接到可植入医疗装置的壳体。 在一个示例中，可植入天线组件被配置为电耦合到可植入遥测电路，该可植入遥测电路被配置为使用可植入遥测天线以电磁方式无线地传送信息，诸如被包括为可植入医疗设备的一部分。
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公开(公告)号：US08761896B2
公开(公告)日：2014-06-24
申请号：US13302202
申请日：2011-11-22
IPC分类号： A61N1/00
CPC分类号： A61N1/37229 , A61B5/0031 , H01Q1/273 , H01Q1/36 , H01Q9/0414 , Y10T29/49016
摘要： In an example, an apparatus can include an implantable medical device comprising a housing, an implantable telemetry circuit carried within the housing, a dielectric compartment mechanically coupled to the housing, the dielectric compartment including first and second substantially parallel face portions and a third face portion extending between the first and second face portions, and an implantable telemetry antenna, located at least partially within the dielectric compartment. The implantable telemetry circuit can be electrically coupled to the implantable telemetry antenna and configured to wirelessly transfer information electromagnetically using the implantable telemetry antenna. In an example the implantable telemetry antenna comprises a spiral conductor portion extending along the first, second, and third face portions. In an example the spiral conductor includes a cross section having a lateral width that can be greater than a sidewall height of the cross section.
摘要翻译： 在一个示例中，装置可以包括可植入医疗装置，其包括壳体，在壳体内承载的可植入遥测电路，机械耦合到壳体的电介质隔室，电介质室包括第一和第二基本上平行的面部分和第三面部分 在第一和第二面部之间延伸，以及至少部分地位于电介质隔室内的可植入遥测天线。 可植入遥测电路可以电耦合到可植入遥测天线，并且被配置为使用可植入遥测天线以电磁方式无线地传送信息。 在一个示例中，可植入遥测天线包括沿着第一，第二和第三面部分延伸的螺旋导体部分。 在一个示例中，螺旋导体包括具有可以大于横截面的侧壁高度的横向宽度的横截面。
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公开(公告)号：US20120130451A1
公开(公告)日：2012-05-24
申请号：US13302324
申请日：2011-11-22
IPC分类号： A61N1/36
CPC分类号： A61N1/37229 , A61B5/0031 , H01Q1/273 , H01Q1/36 , H01Q9/0414 , Y10T29/49016
摘要： Subject matter such as a method or apparatus can include an implantable medical device comprising a housing, an implantable telemetry circuit carried within the housing, and a dielectric compartment, mechanically coupled to the housing an implantable telemetry antenna, such as located at least partially within the dielectric compartment. The implantable telemetry circuit can be electrically coupled to the implantable telemetry antenna and configured to wirelessly transfer information electromagnetically using the implantable telemetry antenna. The implantable telemetry antenna can include a spiral conductor portion extending along a face portion of the dielectric compartment, and a loading portion configured to adjust an input impedance of the implantable telemetry antenna, to provide a specified input impedance range within a specified range of operating frequencies to be used for wireless information transfer.
摘要翻译： 诸如方法或装置的主题可以包括可植入医疗装置，其包括壳体，在壳体内承载的可植入遥测电路和电介质隔室，机械地联接到壳体上的可植入遥测天线，诸如至少部分地位于 电介质隔室。 可植入遥测电路可以电耦合到可植入遥测天线并且被配置为使用可植入遥测天线以电磁方式无线地传送信息。 可植入遥测天线可以包括沿着电介质隔室的面部延伸的螺旋导体部分和被配置成调整可植入遥测天线的输入阻抗的装载部分，以在指定的工作频率范围内提供规定的输入阻抗范围 用于无线信息传输。
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