Invention Application
- Patent Title: METHOD OF FABRICATING ELECTRODE STRUCTURES ON SUBSTRATE
- Patent Title (中): 在基板上制作电极结构的方法
-
Application No.: US13085452Application Date: 2011-04-12
-
Publication No.: US20120055796A1Publication Date: 2012-03-08
- Inventor: Kun-Mu Lee , Sz-Ping Fu , Wei-Hao Chiu , Chuan-Ya Hung
- Applicant: Kun-Mu Lee , Sz-Ping Fu , Wei-Hao Chiu , Chuan-Ya Hung
- Applicant Address: TW HSINCHU
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW HSINCHU
- Priority: TWTW099130285 20100908
- Main IPC: C25D15/00
- IPC: C25D15/00 ; B82Y99/00
Abstract:
Methods for fabricating electrode structures on a substrate are presented. The fabrication method includes providing a substrate with a patterned metal layer thereon, defining an electrode area. A passivation glue is formed on the patterned metal layer. An electrode layer is formed in the electrode area. A filling process is performed to deposit nano metal oxides on the electrode layer to extensively fill the entire electrode area.
Public/Granted literature
- US08470150B2 Method of fabricating electrode structures on substrate Public/Granted day:2013-06-25
Information query
