发明申请
- 专利标题： HEAT DISSIPATION MATERIAL AND LIGHT EMITTING DIODE PACKAGE INCLUDING A JUNCTION PART MADE OF THE HEAT DISSIPATION MATERIAL
- 专利标题（中）： 散热材料和发光二极管封装，包括散热材料的接头部件
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申请号： US13213730申请日： 2011-08-19
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公开(公告)号： US20120056234A1公开(公告)日： 2012-03-08
- 发明人: Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
- 申请人： Eun Sung Lee , Sang Soo Jee , Kun Mo Chu , Se Yun Kim , Kyu Hyoung Lee , Sang Mock Lee
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2010-0081007 20100820
- 主分类号： H01L33/64
- IPC分类号： H01L33/64 ; C22C45/00 ; H01L33/62
摘要：
Disclosed are a heat dissipation material comprising a metallic glass and an organic vehicle and a light emitting diode package including at least one of a junction part, wherein the junction part includes a heat dissipation material including a metallic glass.
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