Invention Application
- Patent Title: INTERLAYER FOR ELECTRONIC DEVICES
- Patent Title (中): 电子设备中间层
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Application No.: US13223784Application Date: 2011-09-01
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Publication No.: US20120056249A1Publication Date: 2012-03-08
- Inventor: David Christoph Mueller , Pawel Miskiewicz , Toby Cull , Piotr Wierzchowiec , Andrew Bell , Edmund Elce , Larry F. Rhodes , Kazuyoshi Fujita , Hendra Ng , Pramod Kandanarachchi , Steven Smith
- Applicant: David Christoph Mueller , Pawel Miskiewicz , Toby Cull , Piotr Wierzchowiec , Andrew Bell , Edmund Elce , Larry F. Rhodes , Kazuyoshi Fujita , Hendra Ng , Pramod Kandanarachchi , Steven Smith
- Applicant Address: US OH Brecksville DE Darmstadt
- Assignee: Promerus LLC,Merck Patent GmbH
- Current Assignee: Promerus LLC,Merck Patent GmbH
- Current Assignee Address: US OH Brecksville DE Darmstadt
- Priority: EP10009119.8 20100902
- Main IPC: B32B27/32
- IPC: B32B27/32 ; C08F136/20 ; H01L21/336 ; C08F232/08 ; H01L29/78 ; C08F236/20 ; C08F132/08
Abstract:
Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such polycycloolefins as interlayers applied to fluoropolymer layers used in the fabrication of electronic devices, the electronic devices that encompass such polycycloolefin interlayers and processes for preparing such polycycloolefin interlayers and electronic devices.
Public/Granted literature
- US09583713B2 Interlayer for electronic devices Public/Granted day:2017-02-28
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