发明申请
- 专利标题： INTERLAYER FOR ELECTRONIC DEVICES
- 专利标题（中）： 电子设备中间层
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申请号： US13223784申请日： 2011-09-01
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公开(公告)号： US20120056249A1公开(公告)日： 2012-03-08
- 发明人: David Christoph Mueller , Pawel Miskiewicz , Toby Cull , Piotr Wierzchowiec , Andrew Bell , Edmund Elce , Larry F. Rhodes , Kazuyoshi Fujita , Hendra Ng , Pramod Kandanarachchi , Steven Smith
- 申请人： David Christoph Mueller , Pawel Miskiewicz , Toby Cull , Piotr Wierzchowiec , Andrew Bell , Edmund Elce , Larry F. Rhodes , Kazuyoshi Fujita , Hendra Ng , Pramod Kandanarachchi , Steven Smith
- 申请人地址： US OH Brecksville DE Darmstadt
- 专利权人： Promerus LLC,Merck Patent GmbH
- 当前专利权人： Promerus LLC,Merck Patent GmbH
- 当前专利权人地址： US OH Brecksville DE Darmstadt
- 优先权： EP10009119.8 20100902
- 主分类号： B32B27/32
- IPC分类号： B32B27/32 ; C08F136/20 ; H01L21/336 ; C08F232/08 ; H01L29/78 ; C08F236/20 ; C08F132/08
摘要：
Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such polycycloolefins as interlayers applied to fluoropolymer layers used in the fabrication of electronic devices, the electronic devices that encompass such polycycloolefin interlayers and processes for preparing such polycycloolefin interlayers and electronic devices.
公开/授权文献
- US09583713B2 Interlayer for electronic devices 公开/授权日：2017-02-28
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