发明申请
- 专利标题： INTEGRATION OF PIEZOELECTRIC MATERIALS WITH SUBSTRATES
- 专利标题（中）： 压电材料与衬底的集成
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申请号： US12899447申请日： 2010-10-06
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公开(公告)号： US20120056510A9公开(公告)日： 2012-03-08
- 发明人: David M. Chen , Jan H. Kuypers , Alexei Gaidarzhy , Guiti Zolfagharkhani , Jason Goodelle
- 申请人： David M. Chen , Jan H. Kuypers , Alexei Gaidarzhy , Guiti Zolfagharkhani , Jason Goodelle
- 申请人地址： US MA Cambridge
- 专利权人： Sand9, Inc.
- 当前专利权人： Sand9, Inc.
- 当前专利权人地址： US MA Cambridge
- 主分类号： H01L41/107
- IPC分类号： H01L41/107 ; H01L41/22 ; H01L41/053 ; H01L41/18 ; H01L41/047
摘要：
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
公开/授权文献
- US08466606B2 Integration of piezoelectric materials with substrates 公开/授权日：2013-06-18
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