发明申请
- 专利标题： METHODS AND LOADPORT APPARATUS FOR PURGING A SUBSTRATE CARRIER
- 专利标题（中）： 用于填充基板载体的方法和装载装置
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申请号： US13287534申请日： 2011-11-02
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公开(公告)号： US20120060971A1公开(公告)日： 2012-03-15
- 发明人: Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin R. Elliott
- 申请人： Vinay K. Shah , Eric Englhardt , Jeffrey C. Hudgens , Martin R. Elliott
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： B65B31/00
- IPC分类号： B65B31/00 ; B65D51/04
摘要：
In a first aspect, a loadport is provided. The loadport has a plate adapted to couple to a door of a substrate carrier to open the substrate carrier wherein the plate includes a first opening adapted to couple to a first port in the door of the substrate carrier on a first side of the plate and to couple to a gas source on a second side of the plate, and wherein the loadport is adapted to allow a flow of gas into the substrate carrier via the first opening in the plate. Methods of purging substrate carriers are provided, as are numerous other aspects.
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