Invention Application
- Patent Title: Printed circuit board having metal bumps
- Patent Title (中): 具有金属凸块的印刷电路板
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Application No.: US13373388Application Date: 2011-11-14
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Publication No.: US20120061132A1Publication Date: 2012-03-15
- Inventor: Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
- Applicant: Myung Sam Kang , Jeong Woo Park , Ok Tae Kim , Kil Yong Yun
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2008-0119895 20081128
- Main IPC: H05K1/09
- IPC: H05K1/09 ; H05K1/11 ; H05K1/02
Abstract:
A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.
Information query
