发明申请
- 专利标题: LIGHT-EMITTING MODULE AND LIGHTING APPARATUS
- 专利标题(中): 发光模组和照明装置
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申请号: US13227133申请日: 2011-09-07
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公开(公告)号: US20120063148A1公开(公告)日: 2012-03-15
- 发明人: Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
- 申请人: Toshiya Tanaka , Akiko Saito , Hitoshi Kawano
- 申请人地址: JP MINATO-KU JP YOKOSUKA-SHI
- 专利权人: KABUSHIKI KAISHA TOSHIBA,TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
- 当前专利权人: KABUSHIKI KAISHA TOSHIBA,TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
- 当前专利权人地址: JP MINATO-KU JP YOKOSUKA-SHI
- 优先权: JP2008-033673 20080214; JP2008-118292 20080430
- 主分类号: F21V7/00
- IPC分类号: F21V7/00
摘要:
A light-emitting module includes a substrate having a front surface side component mounting surface and a rear surface side flat heat dissipating surface. Light-emitting elements are arranged to protrude at a central portion of the component mounting surface and radiate light at least man upper surface direction and in a direction along the component mounting surface. A lighting circuit component is electrically connected to the light emitting elements by a wiring pattern arranged on the substrate and which is arranged closer to the peripheral edge side of the substrate than the light emitting elements: A connector for power supply connection is arranged closer to the peripheral edge side of the substrate than the light emitting elements on the component mounting surface of the substrate and is electrically connected to the lighting circuit component.