Methods and System for On-Chip Decoder for Array Test

Invention Application

US20120064643A1 Methods and System for On-Chip Decoder for Array Test 有权

Title translation: 用于阵列测试的片上解码器的方法和系统

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Patent Title: Methods and System for On-Chip Decoder for Array Test
Patent Title (中): 用于阵列测试的片上解码器的方法和系统
Application No.: US13259800

Application Date: 2010-02-23
Publication No.: US20120064643A1

Publication Date: 2012-03-15
Inventor: Edward J. Bawolek , Curtis D. Moyer , Sameer M. Venugopal
Applicant: Edward J. Bawolek , Curtis D. Moyer , Sameer M. Venugopal
International Application: PCT/US10/24990 WO 20100223
Main IPC: H01L21/66
IPC: H01L21/66 ; G01R31/26

Methods and System for On-Chip Decoder for Array Test

Abstract:

The present invention provides devices capable of testing the electrical performance of thin-film transistor backplane arrays and methods for their use.

Abstract(Chinese):

本发明提供能够测试薄膜晶体管背板阵列的电气性能的装置及其使用方法。

Public/Granted literature

US08722432B2 Methods and system for on-chip decoder for array test Public/Granted day:2014-05-13

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/66	.在制造或处理过程中的测试或测量