发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DIE PADDLES AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 集成电路包装系统及其制造方法
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申请号： US12884102申请日： 2010-09-16
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公开(公告)号： US20120068363A1公开(公告)日： 2012-03-22
- 发明人: Zigmund Ramirez Camacho , Emmanuel Espiritu , Henry Descalzo Bathan
- 申请人： Zigmund Ramirez Camacho , Emmanuel Espiritu , Henry Descalzo Bathan
- 主分类号： H01L23/482
- IPC分类号： H01L23/482 ; H01L21/02 ; H01L21/56
摘要：
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle; attaching an integrated circuit device on the first package paddle and the second package paddle; forming a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device; connecting a paddle connector to the integrated circuit device and the first package paddle and another paddle connector to the integrated circuit device and the second package paddle; and forming an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, the encapsulation exposing a portion of the first package paddle, the second package paddle, and the standoff terminal.
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