公开(公告)号：US20150084172A1

公开(公告)日：2015-03-26

申请号：US14037838

申请日：2013-09-26

申请人： Byung Tai Do ,  Emmanuel Espiritu ,  Allan P. Ilagan ,  Marites Laguipo Roque

发明人： Byung Tai Do ,  Emmanuel Espiritu ,  Allan P. Ilagan ,  Marites Laguipo Roque

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49517 ,  H01L21/4821 ,  H01L21/4828 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/96 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00

摘要： A system and method of manufacture of an integrated circuit packaging system includes: a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body; a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and the half-etched lead portion exposed from a lower perimeter side of the mold body.

摘要翻译： 一种集成电路封装系统的制造方法及其制造方法，其特征在于，包括具有半蚀刻引线部和引线顶侧的可焊接引线的引线框架， 模具主体直接位于引线框架和侧面可焊接引线上，侧面焊接引线的引线顶侧从模具主体露出; 模具体中的模具槽和侧面可焊接引线的一部分，用于将可焊接铅的引线突起暴露在模具主体的上周边侧上; 并且半蚀刻引线部分从模体的下周边侧露出。

公开(公告)号：US08723338B2

公开(公告)日：2014-05-13

申请号：US13586178

申请日：2012-08-15

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/49 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/49861 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing an array of leads having a jumper lead and a covered contact; coupling an insulated bonding wire between the jumper lead and the covered contact; attaching an integrated circuit die over the covered contact; and coupling a bond wire between the integrated circuit die and the jumper lead including coupling the integrated circuit die to the covered contact through the insulated bonding wire.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有跳线和覆盖触点的引线阵列; 将绝缘接合线耦合在跳线和覆盖触点之间; 将集成电路管芯覆盖在覆盖的触点上; 并且在所述集成电路管芯和所述跨接引线之间耦合接合线，包括通过所述绝缘接合线将所述集成电路管芯连接到所述覆盖接触点。

公开(公告)号：US08643166B2

公开(公告)日：2014-02-04

申请号：US13327529

申请日：2011-12-15

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L25/105 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead bottom body, a lead top body, and a lead top conductive layer directly on the lead top body, the lead top conductive layer having a top protrusion and a top non-vertical portion, the lead bottom body having a horizontally contiguous structure; connecting an integrated circuit to the top protrusion; and forming an encapsulation covering the integrated circuit and exposing a top non-vertical upper side of the top non-vertical portion.

摘要翻译： 一种集成电路封装系统的制造方法，其特征在于，包括：在引线顶部主体上直接形成具有引线底部本体，引线顶部主体和引线顶部导电层的引线，所述引线顶部导电层具有顶部突起和 顶部非垂直部分，铅底本体具有水平连续的结构; 将集成电路连接到顶部突起; 以及形成覆盖所述集成电路并暴露所述顶部非垂直部分的顶部非垂直上侧的封装。

公开(公告)号：US08502357B2

公开(公告)日：2013-08-06

申请号：US12856288

申请日：2010-08-13

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L29/00

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/85399

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a package lead having a retention structure around a perimeter of the package lead with a first concave surface, a ridge, and a second concave surface; forming a die attach paddle adjacent the package lead and having an another retention structure around a perimeter of the die attach paddle with an another first concave surface, an another ridge, and an another second concave surface; attaching an integrated circuit die to the die attach paddle; connecting a conductive connector to the integrated circuit die and the package lead; and applying an encapsulation over the integrated circuit die, the encapsulation conformed to the retention structure and exposing a portion of the package lead.

摘要翻译： 一种集成电路封装系统的制造方法，包括：形成具有围绕封装引线的周边的保持结构的封装引线，其具有第一凹表面，脊和第二凹表面; 在所述封装引线附近形成管芯附接焊盘并且具有围绕所述管芯附接焊盘的周边的另一个保持结构，其具有另一个第一凹面，另一个脊和另一个第二凹面; 将集成电路管芯附接到管芯附接焊盘; 将导电连接器连接到集成电路管芯和封装引线; 以及在所述集成电路管芯上施加封装，所述封装符合所述保持结构并暴露所述封装引线的一部分。

公开(公告)号：US20120299196A1

公开(公告)日：2012-11-29

申请号：US13118214

申请日：2011-05-27

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Dioscoro A. Merilo

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu ,  Dioscoro A. Merilo

IPC分类号： H01L23/52 ,  H01L21/56

CPC分类号： H01L23/3107 ,  H01L21/4832 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead having a lead overhang at an obtuse angle to a lead top side and having a lead ridge protruding from a lead non-horizontal side, the lead overhang having a lead overhang-undercut side at an acute angle to a lead overhang non-horizontal side; forming a lead conductive cap completely covering the lead overhang non-horizontal side and the lead top side; forming a package paddle adjacent the lead; mounting an integrated circuit over the package paddle; and forming an encapsulation over the integrated circuit, the package paddle, and the lead.

摘要翻译： 一种集成电路封装系统的制造方法，其特征在于，具有：引线，其具有与铅顶侧成钝角的引线突出部，并且具有从引线非水平侧突出的引线突起，所述引线突出部具有引线突出端， 底切侧与突出的非水平侧成锐角; 形成完全覆盖所述引线突出非水平侧和所述引线顶侧的导电帽; 形成邻近引线的封装焊盘; 在封装桨上安装集成电路; 以及在集成电路，封装焊盘和引线上形成封装。

公开(公告)号：US20120241947A1

公开(公告)日：2012-09-27

申请号：US13071433

申请日：2011-03-24

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L23/498 ,  H01L21/60

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2224/45099

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a hole, a lead extension, and an exterior pad under the lead extension with the hole abutting the lead extension; connecting an electrical interconnect between an integrated circuit and the lead extension; forming an encapsulation over the integrated circuit and surrounding the electrical interconnect and through the hole; and removing a bottom portion of the lead frame resulting in a stand-off lead from the lead extension with the exterior pad on the stand-off lead.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有孔，引线延伸部和引线延伸部下方的外部焊盘的引线框架，所述孔邻接所述引线延伸部; 连接集成电路和引线延伸部之间的电互连; 在集成电路上形成封装并围绕电互连并穿过孔; 并且移除引线框架的底部部分，从而使引线延伸部处于与支撑引线上的外部焊盘相对的间隔引线。

公开(公告)号：US20110233752A1

公开(公告)日：2011-09-29

申请号：US12732423

申请日：2010-03-26

申请人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

发明人： Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Henry Descalzo Bathan

IPC分类号： H01L23/498 ,  H01L21/60 ,  H01L21/56

CPC分类号： H01L24/49 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: forming an elevated contact above and between a lead and a die pad that is coplanar with the lead; connecting an integrated circuit and the lead; attaching a jumper interconnect between the elevated contact and the lead; and forming an encapsulant over the integrated circuit, the lead, the die pad, the elevated contact, and the jumper interconnect, the encapsulant having a recess in a base side with the elevated contact exposed in the recess and the lead exposed from the base side.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在引线与与引线共面的芯片焊盘之上和之间形成升高的触点; 连接集成电路和引线; 在升高的触点和引线之间附接跳线互连; 以及在所述集成电路，所述引线，所述管芯焊盘，所述提升接触件和所述跨接线互连件之上形成密封剂，所述密封剂在基部侧具有凹部，所述凸起接触暴露在所述凹部中，并且所述引线从所述基底侧露出 。

公开(公告)号：US20110169151A1

公开(公告)日：2011-07-14

申请号：US12961494

申请日：2010-12-06

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Emmanuel Espiritu

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49582 ,  H01L2224/16245

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead having an upper portion and a bottom portion with a first overhang portion from a top surface of the upper portion and the lead also having serrations along upper vertical sides intersecting the top surface; forming an upper contact plate on the top surface; forming a bottom contact plate on a bottom surface of the bottom portion; attaching an integrated circuit die over the upper portion; and encapsulating the upper portion and the integrated circuit die with an encapsulation leaving the bottom portion exposed.

摘要翻译： 一种集成电路封装系统的制造方法，包括：从上部的顶面形成具有第一突出部的上部和底部的引线，还具有沿与上表面交叉的上部垂直侧的锯齿 ; 在上表面上形成上接触板; 在所述底部的底面上形成底部接触板; 将集成电路芯片附接在上部上; 并且封装上部和集成电路管芯，其中封装使底部露出。

公开(公告)号：US20110108966A1

公开(公告)日：2011-05-12

申请号：US12729631

申请日：2010-03-23

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu

IPC分类号： H01L23/495 ,  H01L21/50

CPC分类号： H01L23/49548 ,  H01L21/4832 ,  H01L23/49541 ,  H01L24/48 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a conductive layer having a first surface and a second surface; forming first concave trenches in the first surface of the conductive layer and the first concave trenches are connected by a first flat region of the first surface; connecting an integrated circuit to the first flat region with a conductive interconnect; encapsulating the integrated circuit with an encapsulation that fills the first concave trenches; and forming second concave trenches having a similar size in the second surface of the conductive layer with the second concave trenches connected by a second flat region that is larger than the first flat region, and the second concave trenches are formed through the conductive layer to expose the encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有第一表面和第二表面的导电层; 在导电层的第一表面中形成第一凹槽，并且第一凹沟通过第一表面的第一平坦区连接; 用导电互连将集成电路连接到第一平坦区域; 用填充第一凹槽的封装封装集成电路; 以及在所述导电层的第二表面中形成具有相似尺寸的第二凹槽，所述第二凹沟通过大于所述第一平坦区的第二平坦区连接，并且所述第二凹沟通过所述导电层形成以暴露 封装。

公开(公告)号：US20110079888A1

公开(公告)日：2011-04-07

申请号：US12889911

申请日：2010-09-24

申请人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

发明人： Henry Descalzo Bathan ,  Zigmund Ramirez Camacho ,  Emmanuel Espiritu ,  Jeffrey D. Punzalan

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/49582 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: forming a lead-frame having a die attach paddle and a contact pad connected by a link; mounting an integrated circuit die over the die attach paddle; molding a package body on the lead-frame and the integrated circuit die including leaving portions of the die attach paddle, the contact pad, and the link exposed from the package body; forming an exposed edge by etching away the link between the contact pad, and the die attach paddle; and depositing a solder-resistant layer on the exposed edge.

摘要翻译： 一种制造集成电路封装系统的方法，包括：形成具有管芯连接板和通过连接件连接的接触焊盘的引线框架; 在芯片附接板上安装集成电路管芯; 在所述引线框架和所述集成电路管芯上形成封装主体，所述封装主体包括从所述封装主体露出的所述管芯附接焊盘，所述接触焊盘和所述连接部分的部分; 通过蚀刻掉接触垫和管芯附接板之间的连接来形成暴露的边缘; 以及在暴露的边缘上沉积耐焊层。