发明申请
- 专利标题: MAGNETRON SPUTTERING APPARATUS AND ELECTRONIC COMPONENT MANUFACTURING METHOD
- 专利标题(中): 磁控溅射设备和电子元件制造方法
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申请号: US13223830申请日: 2011-09-01
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公开(公告)号: US20120073960A1公开(公告)日: 2012-03-29
- 发明人: Yohsuke SHIBUYA , Masayoshi Ikeda , Yasumi Sago
- 申请人: Yohsuke SHIBUYA , Masayoshi Ikeda , Yasumi Sago
- 申请人地址: JP Kawasaki-shi
- 专利权人: CANON ANELVA CORPORATION
- 当前专利权人: CANON ANELVA CORPORATION
- 当前专利权人地址: JP Kawasaki-shi
- 优先权: JP2009-298237 20091228
- 主分类号: C23C14/35
- IPC分类号: C23C14/35
摘要:
A magnetron sputtering apparatus includes a cathode electrode having a first surface and a second surface opposite to the first surface, a target attachable to the first surface of the cathode electrode, and a magnet unit which is adjacent to the second surface of the cathode electrode and forms a magnetic field on the target surface. The magnet unit includes a plurality of magnet pieces each having a first magnet member which is magnetized in a direction perpendicular to the target and is arranged with a magnetic pole end face oriented toward the target, and a second magnet member which is magnetized opposite to the first magnet member in the direction perpendicular to the target and is arranged in contact with the first magnet member with a magnetic pole end face being oriented toward the target.
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