Invention Application
US20120074094A1 Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier
审中-公开
在非导电载体上形成电路结构的制造方法
- Patent Title: Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier
- Patent Title (中): 在非导电载体上形成电路结构的制造方法
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Application No.: US13206047Application Date: 2011-08-09
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Publication No.: US20120074094A1Publication Date: 2012-03-29
- Inventor: Cheng-Feng Chiang , Jung-Chuan Chiang , Wei-Cheng Fu
- Applicant: Cheng-Feng Chiang , Jung-Chuan Chiang , Wei-Cheng Fu
- Applicant Address: TW Guishan Township
- Assignee: KUANG HONG PRECISION CO., LTD.
- Current Assignee: KUANG HONG PRECISION CO., LTD.
- Current Assignee Address: TW Guishan Township
- Main IPC: H05K3/10
- IPC: H05K3/10 ; H05K3/22 ; B82Y99/00

Abstract:
A manufacturing method of forming an electrical circuit on a non-conductive carrier comprises following steps. After providing an electrically non-conductive carrier, catalysts are dispersed on or in the electrically non-conductive carrier. A predetermined track structure is formed on the electrically non-conductive carrier to expose the catalysts on the surface of the predetermined track structure. The surface of the predetermined track structure containing the catalysts is metalized to form a conductor track.
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