发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有引线封装的集成电路封装系统及其制造方法
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申请号： US12890409申请日： 2010-09-24
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公开(公告)号： US20120074547A1公开(公告)日： 2012-03-29
- 发明人: Byung Tai Do , Reza Argenty Pagaila , Linda Pei Ee Chua , Arnel Senosa Trasporto
- 申请人： Byung Tai Do , Reza Argenty Pagaila , Linda Pei Ee Chua , Arnel Senosa Trasporto
- 主分类号： H01L23/14
- IPC分类号： H01L23/14 ; H01L21/60
摘要：
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle; forming a lead adjacent the package paddle, the lead having a hole in a lead body top side and a lead ridge protruding from a lead non-horizontal side; mounting an integrated circuit over the package paddle; connecting an electrical connector to the lead and the integrated circuit; and forming a fill layer within the hole.
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