发明申请
US20120075709A1 Production Method of Wafer Lens, Intermediate Die, Optical Component, Molding Die, and Production Method of Molding Die
有权
晶片透镜，中间模具，光学部件，成型模具的制造方法以及成型模具的制造方法
- 专利标题： Production Method of Wafer Lens, Intermediate Die, Optical Component, Molding Die, and Production Method of Molding Die
- 专利标题（中）： 晶片透镜，中间模具，光学部件，成型模具的制造方法以及成型模具的制造方法
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申请号： US13377390申请日： 2010-04-07
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公开(公告)号： US20120075709A1公开(公告)日： 2012-03-29
- 发明人: Tougo Teramoto , Shigeru Hosoe , Akira Sato , Toshiyuki Imai , Yuiti Fujii
- 申请人： Tougo Teramoto , Shigeru Hosoe , Akira Sato , Toshiyuki Imai , Yuiti Fujii
- 优先权： JP2009-141325 20090612; JP2009-187099 20090812
- 国际申请： PCT/JP2010/056306 WO 20100407
- 主分类号： G02B3/00
- IPC分类号： G02B3/00 ; G02B1/12 ; B29D11/00 ; G02B1/04
摘要：
Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens (1) includes a first intermediate die production step using a die (7), a second intermediate die production step using the first intermediate die (8), and a wafer lens production step using the second intermediate die (9). A first intermediate-die substrate (80) is provided with a depressed section (85) on the surface facing the die (7). When photo-curable resin (84A) is pressed, at least a portion closer to the first intermediate-die substrate (80) among the top (71a) and the peripheral section (77) of the die (7) is arranged in the depressed section (85), and a gap is provided so that the die (7) does not contact with a depressed plane (85a) of the depressed section (85).
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