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    Production Method of Wafer Lens, Intermediate Die, Optical Component, Molding Die, and Production Method of Molding Die
    1.
    发明申请
    Production Method of Wafer Lens, Intermediate Die, Optical Component, Molding Die, and Production Method of Molding Die 有权
    晶片透镜，中间模具，光学部件，成型模具的制造方法以及成型模具的制造方法

    公开(公告)号：US20120075709A1

    公开(公告)日：2012-03-29

    申请号：US13377390

    申请日：2010-04-07

    申请人： Tougo Teramoto ,  Shigeru Hosoe ,  Akira Sato ,  Toshiyuki Imai ,  Yuiti Fujii

    发明人： Tougo Teramoto ,  Shigeru Hosoe ,  Akira Sato ,  Toshiyuki Imai ,  Yuiti Fujii

    IPC分类号： G02B3/00 ,  G02B1/12 ,  B29D11/00 ,  G02B1/04

    CPC分类号： B29D11/00307 ,  G02B3/0031 ,  G02B13/0085

    摘要： Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens (1) includes a first intermediate die production step using a die (7), a second intermediate die production step using the first intermediate die (8), and a wafer lens production step using the second intermediate die (9). A first intermediate-die substrate (80) is provided with a depressed section (85) on the surface facing the die (7). When photo-curable resin (84A) is pressed, at least a portion closer to the first intermediate-die substrate (80) among the top (71a) and the peripheral section (77) of the die (7) is arranged in the depressed section (85), and a gap is provided so that the die (7) does not contact with a depressed plane (85a) of the depressed section (85).

    摘要翻译： 提供了晶片透镜制造方法，中间模具，光学部件，成型模具和成型模具的制造方法。 晶片透镜（1）的制造方法包括使用模具（7）的第一中间模具制造工序，使用第一中间模具（8）的第二中间模具制造工序和使用第二中间模具的晶片透镜制造工序 （9）。 第一中间模具基板（80）在面向模具（7）的表面上设置有凹部（85）。 当照射光固化树脂（84A）时，在模具（7）的顶部（71a）和周边部分（77）中至少靠近第一中间模具基板（80）的部分设置在凹陷 （85），并且提供间隙，使得模具（7）不与凹部（85）的凹陷平面（85a）接触。

    Production method of wafer lens, intermediate die, optical component, molding die, and production method of molding die
    2.
    发明授权
    Production method of wafer lens, intermediate die, optical component, molding die, and production method of molding die 有权
    晶片透镜，中间模具，光学部件，成型模具的制造方法以及成型模具的制造方法

    公开(公告)号：US08792180B2

    公开(公告)日：2014-07-29

    申请号：US13377390

    申请日：2010-04-07

    申请人： Tougo Teramoto ,  Shigeru Hosoe ,  Akira Sato ,  Toshiyuki Imai ,  Yuiti Fujii

    发明人： Tougo Teramoto ,  Shigeru Hosoe ,  Akira Sato ,  Toshiyuki Imai ,  Yuiti Fujii

    IPC分类号： G02B3/00

    CPC分类号： B29D11/00307 ,  G02B3/0031 ,  G02B13/0085

    摘要： Provided are a wafer lens production method, an intermediate die, an optical component, a molding die, and a molding die production method. The production method of a wafer lens (1) includes a first intermediate die production step using a die (7), a second intermediate die production step using the first intermediate die (8), and a wafer lens production step using the second intermediate die (9). A first intermediate-die substrate (80) is provided with a depressed section (85) on the surface facing the die (7). When photo-curable resin (84A) is pressed, at least a portion closer to the first intermediate-die substrate (80) among the top (71a) and the peripheral section (77) of the die (7) is arranged in the depressed section (85), and a gap is provided so that the die (7) does not contact with a depressed plane (85a) of the depressed section (85).

    摘要翻译： 提供了晶片透镜制造方法，中间模具，光学部件，成型模具和成型模具的制造方法。 晶片透镜（1）的制造方法包括使用模具（7）的第一中间模具制造工序，使用第一中间模具（8）的第二中间模具制造工序和使用第二中间模具的晶片透镜制造工序 （9）。 第一中间模具基板（80）在面向模具（7）的表面上设置有凹部（85）。 当照射光固化树脂（84A）时，在模具（7）的顶部（71a）和周边部分（77）中至少靠近第一中间模具基板（80）的部分设置在凹陷 （85），并且提供间隙，使得模具（7）不与凹部（85）的凹陷平面（85a）接触。

    Apparatus for Manufacturing Wafer Lens, Molding Die, And Method for Manufacturing Wafer Lens
    3.
    发明申请
    Apparatus for Manufacturing Wafer Lens, Molding Die, And Method for Manufacturing Wafer Lens 审中-公开
    用于制造晶片透镜，成型模具的装置以及制造晶片透镜的方法

    公开(公告)号：US20120153518A1

    公开(公告)日：2012-06-21

    申请号：US13392789

    申请日：2010-08-09

    申请人： Yuiti Fujii ,  Tougo Teramoto ,  Shigeru Hosoe ,  Kenichi Iwaida ,  Akira Sato ,  Toshiyuki Imai

    发明人： Yuiti Fujii ,  Tougo Teramoto ,  Shigeru Hosoe ,  Kenichi Iwaida ,  Akira Sato ,  Toshiyuki Imai

    IPC分类号： B29D11/00 ,  B28B5/00 ,  B29C39/02

    CPC分类号： B29C39/10 ,  B29C33/42 ,  B29C39/006 ,  B29D11/00278 ,  B29L2011/0016 ,  G02B3/0031 ,  G02B3/0056

    摘要： An invention for producing a wafer lens is disclosed in which a cured resin is prevented from having projection portions or unfilled sections. The method comprises a dispense step in which resin is dropped onto a die having plural cavities arranged to leave spaces therebetween, an alignment step in which the positions of the die and a glass substrate are adjusted, an imprint step in which one of the die and the glass substrate is pressed against the other, a curing step in which the resin is cured, and a release step in which the glass substrate is released from the die, the steps from the dispense step to the separation step being repeated as one cycle to successively form plastic lens portions on the glass substrate, wherein in the alignment step in each cycle, the cavities of the die are placed between the formed lens parts.

    摘要翻译： 公开了一种用于制造晶片透镜的发明，其中防止固化树脂具有突出部分或未填充部分。 该方法包括一种分配步骤，其中将树脂滴落到具有多个空腔的模具上，该模具具有在其间留下间隔的对准步骤，其中模具和玻璃基板的位置被调节的对准步骤，其中模具和 将玻璃基板压在另一个上，固化步骤，其中树脂固化，以及释放步骤，其中玻璃基板从模具中释放，从分配步骤到分离步骤的步骤被重复为一个循环 在玻璃基板上顺序地形成塑料透镜部分，其中在每个循环中的对准步骤中，模具的空腔被放置在形成的透镜部件之间。

    Image pickup device and method for manufacturing the image pickup device
    4.
    发明授权
    Image pickup device and method for manufacturing the image pickup device 有权
    用于制造图像拾取装置的图像拾取装置和方法

    公开(公告)号：US08792044B2

    公开(公告)日：2014-07-29

    申请号：US13503826

    申请日：2010-10-26

    申请人： Toshiyuki Imai ,  Tougo Teramoto ,  Yasushi Iijima ,  Shigeru Hosoe ,  Akira Sato ,  Yuiti Fujii ,  Daisuke Watanabe

    发明人： Toshiyuki Imai ,  Tougo Teramoto ,  Yasushi Iijima ,  Shigeru Hosoe ,  Akira Sato ,  Yuiti Fujii ,  Daisuke Watanabe

    IPC分类号： H04N5/225

    CPC分类号： G02B13/001 ,  G02B13/0085 ,  H04N5/2254 ,  H04N5/2257

    摘要： Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.

    摘要翻译： 公开了一种图像拾取装置，通过该方式，切割晶片透镜时的切割电阻降低，生产效率高，并且获得了优异的光学特性。 图像拾取装置具有第一透镜块，第二透镜块，间隔件和传感器单元。 第一透镜块的侧表面部分，第二透镜块的侧表面部分和间隔件的侧表面部分形成在同一平面上。 覆盖第一透镜块和第二透镜块的透镜盖设置在由第一透镜块，第二透镜块和间隔件的相应侧表面部分以及传感器单元的侧表面部分形成的台阶中。

    Image Pickup Device and Method for Manufacturing the Image Pickup Device
    5.
    发明申请
    Image Pickup Device and Method for Manufacturing the Image Pickup Device 有权
    图像拾取装置和制造图像拾取装置的方法

    公开(公告)号：US20120218455A1

    公开(公告)日：2012-08-30

    申请号：US13503826

    申请日：2010-10-26

    申请人： Toshiyuki Imai ,  Tougo Teramoto ,  Yasushi Iijima ,  Shigeru Hosoe ,  Akira Sato ,  Yuiti Fujii ,  Daisuke Watanabe

    发明人： Toshiyuki Imai ,  Tougo Teramoto ,  Yasushi Iijima ,  Shigeru Hosoe ,  Akira Sato ,  Yuiti Fujii ,  Daisuke Watanabe

    IPC分类号： H04N5/225

    CPC分类号： G02B13/001 ,  G02B13/0085 ,  H04N5/2254 ,  H04N5/2257

    摘要： Disclosed is an image pickup device, by which cut resistance at the time of cutting a wafer lens is reduced, high production efficiency is maintained, and excellent optical characteristics are obtained. The image pickup device has a first lens block, a second lens block, a spacer, and a sensor unit. The side surface section of the first lens block, the side surface section of the second lens block, and the side surface section of the spacer are formed on the same plane. A lens cover that covers the first and the second lens blocks is provided in a step formed by respective side surface sections of the first lens block, the second lens block and the spacer, and the side surface section of the sensor unit.

    摘要翻译： 公开了一种图像拾取装置，通过该方式，切割晶片透镜时的切割电阻降低，生产效率高，并且获得了优异的光学特性。 图像拾取装置具有第一透镜块，第二透镜块，间隔件和传感器单元。 第一透镜块的侧表面部分，第二透镜块的侧表面部分和间隔件的侧表面部分形成在同一平面上。 覆盖第一透镜块和第二透镜块的透镜盖设置在由第一透镜块，第二透镜块和间隔件的相应侧表面部分以及传感器单元的侧表面部分形成的台阶中。

    Wafer lens, laminated wafer lens, wafer lens cutting method and laminated wafer lens cutting method
    6.
    发明授权
    Wafer lens, laminated wafer lens, wafer lens cutting method and laminated wafer lens cutting method 有权
    晶片透镜，层压晶片透镜，晶片透镜切割方法和层压晶片透镜切割方法

    公开(公告)号：US08928982B2

    公开(公告)日：2015-01-06

    申请号：US13642654

    申请日：2011-04-20

    申请人： Tougo Teramoto ,  Akira Sato ,  Tohru Tominami

    发明人： Tougo Teramoto ,  Akira Sato ,  Tohru Tominami

    IPC分类号： G02B27/10 ,  G02B13/00 ,  G02B3/00

    CPC分类号： G02B13/0085 ,  G02B3/0012 ,  G02B3/0056 ,  G02B13/006 ,  Y10T83/0524 ,  Y10T156/1052

    摘要： A laminated wafer lens includes a wafer lens and a spacer substrate bonded to each other. The wafer lens includes a resin section provided on a surface of a glass substrate. The resin section includes lens portions and interval portions, each interval portion provided between adjacent lens portions. The spacer substrate has openings at positions corresponding to the respective lens portions. The lens portions are arrayed in row and column directions in a matrix fashion. The interval portions include first and second interval portions, the second interval portion longer than the first interval portion. The spacer substrate includes interval portions each of which is provided between adjacent openings. The interval portions include third and fourth interval portions corresponding to the first and second interval portions, respectively, the fourth interval portion being longer than the third interval portion.

    摘要翻译： 层叠晶片透镜包括彼此结合的晶片透镜和间隔基板。 晶片透镜包括设置在玻璃基板的表面上的树脂部。 树脂部分包括透镜部分和间隔部分，每个间隔部分设置在相邻透镜部分之间。 间隔基板在对应于各个透镜部分的位置处具有开口。 透镜部分以矩阵方式排列在行和列方向上。 间隔部分包括第一和第二间隔部分，第二间隔部分比第一间隔部分长。 间隔基板包括间隔部分，每个间隔部分设置在相邻的开口之间。 间隔部分分别包括对应于第一和第二间隔部分的第三和第四间隔部分，第四间隔部分比第三间隔部分长。

    Wafer Lens, Laminated Wafer Lens, Wafer Lens Cutting Method and Laminated Wafer Lens Cutting Method
    7.
    发明申请
    Wafer Lens, Laminated Wafer Lens, Wafer Lens Cutting Method and Laminated Wafer Lens Cutting Method 有权
    晶圆透镜，层压晶片透镜，晶片切割方法和层压晶片切割方法

    公开(公告)号：US20130038952A1

    公开(公告)日：2013-02-14

    申请号：US13642654

    申请日：2011-04-20

    申请人： Tougo Teramoto ,  Akira Sato ,  Tohru Tominami

    发明人： Tougo Teramoto ,  Akira Sato ,  Tohru Tominami

    IPC分类号： G02B3/00 ,  B32B37/14 ,  B32B38/04 ,  B26D3/00

    CPC分类号： G02B13/0085 ,  G02B3/0012 ,  G02B3/0056 ,  G02B13/006 ,  Y10T83/0524 ,  Y10T156/1052

    摘要： A laminated wafer lens includes a wafer lens and a spacer substrate bonded to each other. The wafer lens includes a resin section provided on a surface of a glass substrate. The resin section includes lens portions and interval portions, each interval portion provided between adjacent lens portions. The spacer substrate has openings at positions corresponding to the respective lens portions. The lens portions are arrayed in row and column directions in a matrix fashion. The interval portions include first and second interval portions, the second interval portion longer than the first interval portion. The spacer substrate includes interval portions each of which is provided between adjacent openings. The interval portions include third and fourth interval portions corresponding to the first and second interval portions, respectively, the fourth interval portion being longer than the third interval portion.

    摘要翻译： 层叠晶片透镜包括彼此结合的晶片透镜和间隔基板。 晶片透镜包括设置在玻璃基板的表面上的树脂部。 树脂部分包括透镜部分和间隔部分，每个间隔部分设置在相邻透镜部分之间。 间隔基板在对应于各个透镜部分的位置处具有开口。 透镜部分以矩阵方式排列在行和列方向上。 间隔部分包括第一和第二间隔部分，第二间隔部分比第一间隔部分长。 间隔基板包括间隔部分，每个间隔部分设置在相邻的开口之间。 间隔部分分别包括对应于第一和第二间隔部分的第三和第四间隔部分，第四间隔部分比第三间隔部分长。

    Powder magnetic core and the method of manufacturing the same
    9.
    发明授权
    Powder magnetic core and the method of manufacturing the same 有权
    粉末磁芯及其制造方法

    公开(公告)号：US08974608B2

    公开(公告)日：2015-03-10

    申请号：US12081490

    申请日：2008-04-16

    申请人： Takayuki Hirose ,  Masaharu Edo ,  Akira Sato

    发明人： Takayuki Hirose ,  Masaharu Edo ,  Akira Sato

    IPC分类号： B22F1/00 ,  H01F1/00 ,  H01F1/03 ,  C22C1/00 ,  H01F41/02 ,  B22F1/02 ,  B22F7/02 ,  C22C33/02 ,  H01F1/24

    CPC分类号： H01F41/0246 ,  B22F1/02 ,  B22F7/02 ,  B22F2998/10 ,  C22C33/0228 ,  C22C2202/02 ,  H01F1/24 ,  B22F3/02

    摘要： A powder magnetic core with improved high frequency magnetic characteristics and reduced eddy current loss is manufactured by a manufacturing method including the steps of (a) providing coated soft magnetic particles which are particles composed of soft magnetic material which each have been coated with an insulating coating, and insulator particles; (b) forming a magnetic layer by press molding the coated soft magnetic particles in a mold assembly; (c) forming an insulator layer on the magnetic layer by press molding the insulator particles in the mold assembly; and (d) repeating the steps (b) and (c) to fabricate a laminate of alternating magnetic layers and insulator layers and provide the powder magnetic core.

    摘要翻译： 通过制造方法制造具有改善的高频磁特性和降低的涡流损耗的粉末磁芯，其包括以下步骤：（a）提供涂覆的软磁性颗粒，其是由软磁性材料构成的颗粒，每个软磁性颗粒均涂覆有绝缘涂层 ，和绝缘体颗粒; （b）通过在模具组件中压制成型所涂覆的软磁性颗粒来形成磁性层; （c）通过在所述模具组件中压模所述绝缘体颗粒在所述磁性层上形成绝缘体层; 和（d）重复步骤（b）和（c）以制造交替磁层和绝缘体层的叠层，并提供粉末磁芯。

    Electronic device and method for manufacturing thereof
    10.
    发明授权
    Electronic device and method for manufacturing thereof 有权
    电子装置及其制造方法

    公开(公告)号：US08410561B2

    公开(公告)日：2013-04-02

    申请号：US12975065

    申请日：2010-12-21

    申请人： Akira Sato ,  Toru Watanabe ,  Shogo Inaba ,  Takeshi Mori

    发明人： Akira Sato ,  Toru Watanabe ,  Shogo Inaba ,  Takeshi Mori

    IPC分类号： H01L31/00

    CPC分类号： B81C1/00246 ,  B81B2207/015 ,  B81B2207/07 ,  B81C2203/0136 ,  B81C2203/0714 ,  B81C2203/0735 ,  H01L21/7682 ,  H01L24/05 ,  H01L2924/14 ,  H01L2924/00

    摘要： An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure.

    摘要翻译： 公开了一种电子设备，包括基板，构成在基板上形成的功能元件的功能结构，以及形成其中设置有功能结构的空腔部分的盖结构。 在电子设备中，盖结构包括层间绝缘膜和布线层的叠层结构，层叠结构以包围空腔部分的方式形成在基板上，盖结构具有上侧盖部分 从上方覆盖空腔部分，上侧盖部分形成有设置在功能结构上方的布线层的一部分。