发明申请
- 专利标题: SEMICONDUCTOR MODULE DESIGN METHOD AND SEMICONDUCTOR MODULE
- 专利标题(中): 半导体模块设计方法和半导体模块
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申请号: US13238935申请日: 2011-09-21
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公开(公告)号: US20120079446A1公开(公告)日: 2012-03-29
- 发明人: Hiromichi KUMAKURA , Hiroyuki Ogino , Kenji Fujimoto , Masanori Ueno
- 申请人: Hiromichi KUMAKURA , Hiroyuki Ogino , Kenji Fujimoto , Masanori Ueno
- 优先权: JP2010-215577 20100927
- 主分类号: G06F17/50
- IPC分类号: G06F17/50
摘要:
A semiconductor module made from a compound semiconductor or diamond and loaded with high performance power semiconductor devices can be obtained at low cost. In a semiconductor module, four (semiconductor chips) of same specifications are arranged in array, two longitudinally and two transversally, on a single lead frame. Achieving a high yield of manufacturing diode chips and reducing the unuseful area of diode chips need to be satisfied at the same time to obtain such a semiconductor module at low cost. The use of an index, which is the product of the yield YDie of manufacturing chips and the active region area ratio RA is effective for determining them. Thus, semiconductor modules can be obtained at a high yield by selecting a chip size that makes the index close to a peak value depending on the crystal defect density of a wafer to be used.
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