公开(公告)号：US20120079446A1

公开(公告)日：2012-03-29

申请号：US13238935

申请日：2011-09-21

申请人： Hiromichi KUMAKURA ,  Hiroyuki Ogino ,  Kenji Fujimoto ,  Masanori Ueno

发明人： Hiromichi KUMAKURA ,  Hiroyuki Ogino ,  Kenji Fujimoto ,  Masanori Ueno

IPC分类号： G06F17/50

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L2224/32245 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/10344 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

摘要： A semiconductor module made from a compound semiconductor or diamond and loaded with high performance power semiconductor devices can be obtained at low cost. In a semiconductor module, four (semiconductor chips) of same specifications are arranged in array, two longitudinally and two transversally, on a single lead frame. Achieving a high yield of manufacturing diode chips and reducing the unuseful area of diode chips need to be satisfied at the same time to obtain such a semiconductor module at low cost. The use of an index, which is the product of the yield YDie of manufacturing chips and the active region area ratio RA is effective for determining them. Thus, semiconductor modules can be obtained at a high yield by selecting a chip size that makes the index close to a peak value depending on the crystal defect density of a wafer to be used.

摘要翻译： 可以以低成本获得由化合物半导体或金刚石制成的负载高性能功率半导体器件的半导体模块。 在半导体模块中，具有相同规格的四个（半导体芯片）在一个引线框架上被排列成纵向和横向两个。 需要同时满足制造二极管芯片的高产量并减少二极管芯片的无用面积以便以低成本获得这种半导体模块。 使用指数，其是制造芯片的产量YDie和有效区域面积比RA的乘积对于确定它们是有效的。 因此，通过选择根据所使用的晶片的晶体缺陷密度使指标接近峰值的芯片尺寸，可以以高产率获得半导体模块。