Some embodiments of the inventive subject matter are directed to a first circuit board configured to include an electronic component. The electronic component includes a plurality of leads. The first circuit board includes first wires configured to connect to a first portion of the plurality of leads. The second circuit board is affixed to the first circuit board. The second circuit board includes second wires. The second circuit board is smaller in size than the first circuit board. A plurality of electrical connectors extend through a thickness of the first circuit board and are configured to connect a second portion of the plurality of leads to the second wires.