An electrochemical device capable of enhancing sealing performance of a lead terminal leading portion in an exterior film for accommodating an electrochemical element is provided. In an electrochemical device in which an electrochemical element 10 is covered by a laminated outer packaging film 4 having at least an innermost layer 41 made of heat adhesive synthetic resin, a sealing portion 4d of the outer packaging film 4 is heat sealed. A laminated-type lead terminal coating film 7 is arranged at a lead terminal 5, 6 connected to the electrochemical element 10 corresponding to the sealing portion 4d of the outer packaging film 4, and the melding point of the outermost layer 73 of the lead terminal coating film 7 is set to be lower than the melding point of the innermost layer 41 of the outer packaging film 4.