发明申请
- 专利标题: SUBSTRATE COATING DEVICE
- 专利标题(中): 基板涂层设备
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申请号: US13377606申请日: 2010-04-19
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公开(公告)号: US20120085282A1公开(公告)日: 2012-04-12
- 发明人: Yoshinori Ikagawa , Mitsunori Oda , Minoru Yamamoto , Takashi Kawaguchi , Hideo Hirata , Masaaki Tanabe
- 申请人: Yoshinori Ikagawa , Mitsunori Oda , Minoru Yamamoto , Takashi Kawaguchi , Hideo Hirata , Masaaki Tanabe
- 申请人地址: JP Okayama
- 专利权人: TAZMO CO., LTD.
- 当前专利权人: TAZMO CO., LTD.
- 当前专利权人地址: JP Okayama
- 优先权: JP2009-146778 20090619
- 国际申请: PCT/JP2010/056928 WO 20100419
- 主分类号: B05C5/00
- IPC分类号: B05C5/00
摘要:
A substrate coating device is provided which is capable of reducing non-uniform film thickness areas that take place in a coating start portion and a coating end portion during coating using a slit nozzle coater.The substrate coating device (10) includes at least a slider driving motor (4), a pump (8), a delivery state quantity measuring section (82), and a control section (5). The slider driving motor (4) scans a slit nozzle (1) over a substrate (100) at an established velocity relative to the substrate (100). The pump (8) controls the supply of the coating liquid to the slit nozzle (1). The delivery state quantity measuring section (82) is configured to measure a state quantity indicative of a delivery state of the coating liquid from the tip of the slit nozzle (1). The control section (5) corrects control information to be fed to the slider driving motor (4) in such a manner as to cancel out a difference between control information fed to the pump (8) and measurement information fed from the delivery state quantity measuring section (82) based on difference information indicative of the difference.
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