发明申请
- 专利标题： Electronic Apparatus Manufacturing Method, Electronic Component, and Electronic Apparatus
- 专利标题（中）： 电子设备制造方法，电子部件和电子设备
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申请号： US13093641申请日： 2011-04-25
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公开(公告)号： US20120085575A1公开(公告)日： 2012-04-12
- 发明人: Nobuhiro Yamamoto , Takahisa Funayama
- 申请人： Nobuhiro Yamamoto , Takahisa Funayama
- 优先权： JP2010-228779 20101008
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H05K3/34
摘要：
According to one embodiment, a manufacturing method for an electronic apparatus, which includes a housing, a substrate, pads on the substrate, and an electronic component, which includes a component body including a bottom surface, terminals arranged on the bottom surface of the component body, and a thermosetting resin disposed on the bottom surface of the component body and configured to remove an oxide film when heated, and is mounted on the substrate, the method includes putting the electronic component on the substrate, heating the electronic component, thereby softening the resin, causing the softened resin to flow, thereby forcing out a gas between the electronic component and the substrate and filling the resin between the electronic component and the substrate, and further heating the electronic component, thereby solder-bonding the terminals and the pads to one another and curing the resin between the electronic component and the substrate.
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