Invention Application
- Patent Title: INTERPOSER AND MANUFACTURING METHOD FOR THE SAME
- Patent Title (中): 其相关的制程和制造方法
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Application No.: US13328710Application Date: 2011-12-16
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Publication No.: US20120085655A1Publication Date: 2012-04-12
- Inventor: Kenichi Kagawa , Tomohisa Hoshino , Masami Yakabe
- Applicant: Kenichi Kagawa , Tomohisa Hoshino , Masami Yakabe
- Assignee: Tokyo Elecron Limited
- Current Assignee: Tokyo Elecron Limited
- Priority: JPJP2004-199785 20040706; JPJP2004-199870 20040706
- Main IPC: C25D5/02
- IPC: C25D5/02 ; B05D5/12
Abstract:
In a manufacturing method for an interposer, a seed layer is formed at an opening portion in a through hole on back surface side of a substrate, an electrode layer for electroplated coating is formed based on the seed layer, and an electroplated coating layer is formed to fill the through hole from the electrode layer for electroplated coating layer to a front surface side. As a result, a manufacturing method for an interposer is provided in which the manufacturing process is simple and the void is not generated inside of the through hole.
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