发明申请
- 专利标题： SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
- 专利标题（中）： 固态成像装置及其制造方法及电子设备
-
申请号： US13248457申请日： 2011-09-29
-
公开(公告)号： US20120086092A1公开(公告)日： 2012-04-12
- 发明人: Takeshi Yanagita , Hiroshi Ozaki , Shin Iwabuchi , Tomoharu Ogita
- 申请人： Takeshi Yanagita , Hiroshi Ozaki , Shin Iwabuchi , Tomoharu Ogita
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-227756 20101007
- 主分类号： H01L31/0232
- IPC分类号： H01L31/0232 ; H01L31/0224
摘要：
A solid-state imaging device includes a substrate in which a plurality of pixels including photoelectric converters are formed, a wiring layer that includes wirings in a plurality of layers formed via an interlayer insulating film in a front surface side of the substrate, a base electrode pad portion that includes a portion of the wirings formed in the wiring layer, an opening that penetrates the substrate from a rear surface side of the substrate and reaches the base electrode pad portion, and an embedded electrode pad layer that is formed so as to be embedded in the opening by electroless plating.
公开/授权文献
- US09263490B2 Methods of forming integrated circuits 公开/授权日：2016-02-16
信息查询
IPC分类:
