发明申请
- 专利标题： SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
- 专利标题（中）： 固态成像装置，制造固态成像装置的方法和电子装置
-
申请号： US13249825申请日： 2011-09-30
-
公开(公告)号： US20120086845A1公开(公告)日： 2012-04-12
- 发明人: Takayuki Enomoto , Hideaki Togashi
- 申请人： Takayuki Enomoto , Hideaki Togashi
- 申请人地址： JP Tokyo
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-227757 20101007
- 主分类号： H04N5/335
- IPC分类号： H04N5/335 ; H01L31/18 ; H01L27/14
摘要：
A solid-state imaging device includes a substrate, a through-hole, a vertical gate electrode, and a charge fixing film. A photoelectric conversion unit generating signal charges in accordance with the amount of received light is formed in the substrate. The through-hole is formed from a front surface side through a rear surface side of the substrate. The vertical gate electrode is formed through a gate insulating film in the through-hole and reads out the signal charges generated by the photoelectric conversion unit to a reading-out portion. The charge fixing film has negative fixed charges formed to cover a portion of the inner circumferential surface of the through-hole at the rear surface side of the substrate while covering the rear surface side of the substrate.
公开/授权文献
信息查询
