发明申请
- 专利标题： PRINTED CIRCUIT BOARD HAVING ELETRONIC COMPONENTS EMBEDDED THEREIN
- 专利标题（中）： 印有电路板的印刷电路板
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申请号： US12972371申请日： 2010-12-17
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公开(公告)号： US20120087097A1公开(公告)日： 2012-04-12
- 发明人: Suk Chang HONG , Bong Kyu CHOI , Je Gwang Yoo , Sang Wuk JUN , Sang Kab PARK , Jung Soo Byun
- 申请人： Suk Chang HONG , Bong Kyu CHOI , Je Gwang Yoo , Sang Wuk JUN , Sang Kab PARK , Jung Soo Byun
- 申请人地址： KR Gyeonggi-do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR10-2010-0097930 20101007
- 主分类号： H05K1/18
- IPC分类号： H05K1/18
摘要：
Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.