发明申请
US20120091584A1 BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP, AND STACKED SEMICONDUCTOR PACKAGE
有权
半导体封装的BUG，具有BUMP的半导体封装和堆叠半导体封装
- 专利标题： BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP, AND STACKED SEMICONDUCTOR PACKAGE
- 专利标题（中）： 半导体封装的BUG，具有BUMP的半导体封装和堆叠半导体封装
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申请号： US12981329申请日： 2010-12-29
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公开(公告)号： US20120091584A1公开(公告)日： 2012-04-19
- 发明人: Ki Young KIM , Qwan Ho CHUNG , Sung Ho HYUN , Myung Gun PARK , Jin Ho BAE
- 申请人： Ki Young KIM , Qwan Ho CHUNG , Sung Ho HYUN , Myung Gun PARK , Jin Ho BAE
- 申请人地址： KR Icheon-si
- 专利权人： HYNIX SEMICONDUCTOR INC.
- 当前专利权人： HYNIX SEMICONDUCTOR INC.
- 当前专利权人地址： KR Icheon-si
- 优先权： KR10-2010-0101734 20101019
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
A bump for a semiconductor package includes: a first bump formed on a semiconductor chip and having at least two land parts and a connection part which connects the land parts and has a line width smaller than the land parts; and a second bump formed on the first bump and projecting on the land parts of the first bump in shapes of a hemisphere.
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