发明申请
US20120097976A1 LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THE SAME 有权
发光二极管芯片及其制造方法

LIGHT EMITTING DIODE CHIP AND METHOD FOR MANUFACTURING THE SAME
摘要:
A light emitting diode chip includes an electrically conductive substrate, a reflecting layer disposed on the substrate, a semiconductor structure formed on the reflecting layer, an electrode disposed on the semiconductor structure, and a plurality of slots extending through the semiconductor structure. The semiconductor structure includes a P-type semiconductor layer formed on the reflecting layer, a light-emitting layer formed on the P-type semiconductor layer, and an N-type semiconductor layer formed on the light-emitting layer. A current diffusing region is defined in the semiconductor structure and around the electrode. The slots are located outside the current diffusing region.
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