A glue composition for use in printed circuit board to secure, insulates and protect electronic components thereon is disclosed. The glue composition includes between about 60 and about 75 weight percent MDI-based polyisocyanate prepolymer, between about 9 and about 25 weight percent flame retardant without phosphorus and halogen, between about 15 and about 22 weight percent insulator and between about 1 and about 3 weight percent surfactant.