发明申请
- 专利标题： Photosensitive composite and build-up insulation film with the photosensitive composite, and method for manufacturing circuit board using the build-up insulation film
- 专利标题（中）： 光敏复合材料的光敏复合和堆积绝缘膜，以及使用积层绝缘膜制造电路板的方法
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申请号： US13137937申请日： 2011-09-21
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公开(公告)号： US20120103507A1公开(公告)日： 2012-05-03
- 发明人: Jae Choon Cho , Hyung Mi Jung , Hwa Young Lee , Choon Keun Lee
- 申请人： Jae Choon Cho , Hyung Mi Jung , Hwa Young Lee , Choon Keun Lee
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2010-0108176 20101102
- 主分类号： B32B38/04
- IPC分类号： B32B38/04 ; G03F7/09 ; B32B37/14 ; H01L21/02 ; B32B37/02 ; G03F7/028 ; G03F7/38
摘要：
Disclosed herein is a method for manufacturing a circuit board. The method for manufacturing a circuit board includes: preparing a photosensitive composite; preparing a build-up insulating film by casting the photosensitive composite into a film made of poly ethylene terephthalate (PET) material; stacking the build-up insulation film on the board; forming via holes on the build-up insulation film by using a photolithography process; and forming conductive vias in the via holes.