公开(公告)号：US20250063896A1

公开(公告)日：2025-02-20

申请号：US18808465

申请日：2024-08-19

Applicant: Hye Jung CHOI ,  Kyung Soo KIM

Inventor： Hye Jung CHOI ,  Kyung Soo KIM

IPC: H10K59/122 ,  G03F7/00 ,  G03F7/028 ,  G03F7/032 ,  G03F7/16 ,  H10K59/12 ,  H10K71/20

Abstract: Provided is a single process of performing coating; prebaking; exposure; and development for implementing a coloring pattern capable of reducing the process time on an electrode substrate by integrating the two processes of layers of PDL and CS of an organic light-emitting diode panel into one, which can reduce scratches caused by a metal mask during deposition by managing the half-tone thickness to 1.25 to 2.20 μm and the full-tone thickness to be 3.20 to 3.40 μm, and form a pattern by adjusting the UV active line transmittance of the photomask to three sections of 0% (non-exposed portion), 15 to 60% (half-tone), and 100% (full-tone), creating a step height of the pattern after the development process is completed, while including a coloring agent.

公开(公告)号：US20240321803A1

公开(公告)日：2024-09-26

申请号：US18274479

申请日：2022-02-10

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Akihiko Otoguro ,  Keita Imai ,  Yuki Ueda ,  Toshiharu Kuboyama

IPC: H01L23/00 ,  G03F7/028 ,  G03F7/037 ,  G03F7/075

CPC classification number: H01L24/20 ,  G03F7/028 ,  G03F7/037 ,  G03F7/0752 ,  H01L2224/2101 ,  H01L2224/215 ,  H01L2924/37001

Abstract: The photosensitive resin composition of the present invention includes a polymer A having a structural unit represented by General Formula (a) and a polymer B including a polyimide having a group b represented by General Formula (b).

公开(公告)号：US20240317904A1

公开(公告)日：2024-09-26

申请号：US18276746

申请日：2022-02-11

Applicant: XETOS AG

Inventor： Frank Knocke

IPC: C08F2/44 ,  C08F2/50 ,  G02B27/01 ,  G03F7/00 ,  G03F7/028

CPC classification number: C08F2/44 ,  C08F2/50 ,  G02B27/0103 ,  G03F7/001 ,  G03F7/028 ,  G02B2027/0109

Abstract: The present invention relates to UV/VIS photopolymerizable compositions and elements prepared therefrom and their use. In particular to recording materials for optical elements with refractive index modulation, especially holograms.

公开(公告)号：US20240191056A1

公开(公告)日：2024-06-13

申请号：US18552322

申请日：2022-03-28

Applicant: PT SPE SUBCO LLC ,  PIXELLIGENT TECHNOLOGIES LLC

Inventor： Peter Christopher GUSCHL ,  Grace E. M. MCCLINTOCK ,  Mohammadreza AMIRMOSHIRI

IPC: C08K3/22 ,  C08F222/10 ,  G03F7/00 ,  G03F7/004 ,  G03F7/028

CPC classification number: C08K3/22 ,  C08F222/102 ,  G03F7/0002 ,  G03F7/0047 ,  G03F7/028 ,  C08K2003/2237 ,  C08K2003/2244 ,  C08K2201/011

Abstract: The present disclosure provides a high-refractive index acrylic formulation comprised of sub-30 nm zirconium and/or titanium oxide nanocrystals. The formulation is solvent-containing or solvent-free, of imprintable and/or inkjet-printable viscosities, can be applied by multiple film deposition techniques and produces high-refractive index, high transparency nanocomposites for a variety of optical applications including AR/VR/MR and display applications.

公开(公告)号：US20240043281A1

公开(公告)日：2024-02-08

申请号：US18266249

申请日：2021-12-07

Applicant: TSINGHUA UNIVERSITY ,  BEIJING VFORTUNE NEW ENERGY POWER TECHNOLOGY DEVELOPMENT CO., LTD.

Inventor： HONG XU ,  XIANG-MING HE ,  XIAO-LIN WANG

IPC: C01G25/02 ,  G03F7/004 ,  G03F7/32 ,  G03F7/028 ,  G03F7/20

CPC classification number: C01G25/02 ,  G03F7/0042 ,  G03F7/0048 ,  G03F7/0045 ,  G03F7/32 ,  G03F7/028 ,  G03F7/2004

Abstract: A photoresist, a photoresist composition, a method for patterning a photoresist and a method for preparing a printed circuit board are disclosed in the present application. The photoresist includes an organic solvent and titanium zirconium oxide nanoparticles. The general molecular formula of the titanium zirconium oxide nanoparticles is TixZryOzLn, wherein x, y and z are each independently an integer in a range from 1 to 6, n is an integer in a range from 5 to 30, and L is an organic ligand including a free-radical polymerizable group.

公开(公告)号：US11886114B2

公开(公告)日：2024-01-30

申请号：US16995420

申请日：2020-08-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kenta Kondo ,  Shimpei Tanabe

IPC: C03C8/20 ,  G03F7/004 ,  H05K3/00 ,  H05K1/03 ,  H05K3/46 ,  G03F7/028

CPC classification number: G03F7/0047 ,  C03C8/20 ,  G03F7/028 ,  H05K1/0306 ,  H05K3/0023 ,  H05K3/4667

Abstract: A photosensitive insulating paste according to preferred embodiments of the present disclosure contains glass frit, a first inorganic filler, a second inorganic filler, an alkali-soluble polymer, a photosensitive monomer, a photopolymerization initiator, and a solvent. The first inorganic filler has a refractive index of 1.7 or higher. The second inorganic filler has a refractive index of 1.55 or lower. An electronic component according to preferred embodiments of the present disclosure is produced by using the photosensitive insulating paste.

公开(公告)号：US20230375930A1

公开(公告)日：2023-11-23

申请号：US18030668

申请日：2021-09-24

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： Shinichi KUNIMATSU ,  Junya KOSAKA

IPC: G03F7/09 ,  G03F7/115 ,  G03F7/039 ,  G03F7/038 ,  G03F7/028

CPC classification number: G03F7/094 ,  G03F7/115 ,  G03F7/039 ,  G03F7/038 ,  G03F7/028

Abstract: The present disclosure provides a photosensitive resin multilayer body which comprises a support film and a photosensitive resin layer that is superposed on the support film. The photosensitive resin layer contains from 30% by mass to 70% by mass of an alkali-soluble polymer, from 20% by mass to 50% by mass of a compound that has an ethylenically unsaturated double bond, and from 0.01% by mass to 20% by mass of a photopolymerization initiator. The alkali-soluble polymer has an acid equivalent weight of 350 or more, while containing, as a copolymerization component, a (meth)acrylate that has an aromatic group. The compound that has an ethylenically unsaturated double bond contains from 50% by mass to 100% by mass of an acrylate monomer based on the total mass of the compound, while having a double-bond equivalent weight of 150 or more. The photosensitive resin layer has a thickness of 30 μm or more.

公开(公告)号：US11807721B2

公开(公告)日：2023-11-07

申请号：US17043444

申请日：2018-04-03

Applicant: HD MICROSYSTEMS, LTD.

Inventor： Satoshi Yoneda ,  Tetsuya Enomoto

IPC: G03F7/40 ,  C08G73/12 ,  C08F290/06 ,  G03F7/028 ,  G03F7/039 ,  G03F7/038

CPC classification number: C08G73/121 ,  C08F290/065 ,  C08G73/12 ,  G03F7/028 ,  G03F7/039 ,  G03F7/0387 ,  G03F7/40

Abstract: A method for producing a polyimide precursor having a structural unit represented by the following formula (1),



comprising the following steps (i) and (ii), wherein at least one of the steps of (i) and (ii) is carried out in a solvent comprising a compound having an ether bond and an amide bond:
(i) a step of reacting carboxylic anhydride with a diamine compound to obtain a polyimide precursor having a structural unit represented by the following formula (2); and
(ii) a step of reacting the polyimide precursor having a structural unit represented by the formula (2) with a compound represented by the following formula (8), and reacting the reactant with a compound represented by the following formula (9) to obtain a polyimide precursor having a structural unit represented by the following formula (1):










wherein in the formula (1), at least one of R1 and R2 is a group represented by the formula (3):

公开(公告)号：US20230324799A1

公开(公告)日：2023-10-12

申请号：US18324825

申请日：2023-05-26

Applicant: FaradaIC Sensors GmbH

Inventor： Ryan GUTERMAN

IPC: G03F7/075 ,  G03F7/028

CPC classification number: G03F7/0757 ,  G03F7/028 ,  G03F7/0752

Abstract: A resist mixture for manufacturing an ion-conductor. In some examples the mixture is crosslinkable and comprises: a polymer comprising siloxane; a crosslinker; and a salt comprising a cationic component, and an anionic component. In other examples the mixture is polymerisable and comprises: a polymer comprising siloxane; a monomer; and a salt comprising a cationic component, and an anionic component. At least one of the cationic component or the anionic component is bonded to the polymer.

公开(公告)号：US20230168581A1

公开(公告)日：2023-06-01

申请号：US18159380

申请日：2023-01-25

Applicant: FUJIFILM Corporation

Inventor： Michihiro SHIRAKAWA ,  Akiyoshi Goto

IPC: G03F7/039 ,  G03F7/028

CPC classification number: G03F7/039 ,  G03F7/028

Abstract: An object of the present invention is to provide an actinic ray-sensitive or radiation-sensitive resin composition by which a pattern having excellent LWR performance can be formed. In addition, another object of the present invention is to provide a resist film, a pattern forming method, and a method for manufacturing an electronic device, each relating to the actinic ray-sensitive or radiation-sensitive resin composition.
The actinic ray-sensitive or radiation-sensitive resin composition according to an embodiment of the present invention is an actinic ray-sensitive or radiation-sensitive resin composition including an acid-decomposable resin including a repeating unit having an acid-decomposable group in which an acid group having a pKa of 13 or less is protected by a leaving group that leaves by an action of an acid, and one or more compounds that generate an acid upon irradiation with actinic rays or radiation, which are selected from a compound (I) and a compound (II),
in which the content of the acid-decomposable resin is 10% by mass or more with respect to a total solid content of the composition,
the content of the compounds that generate an acid upon irradiation with actinic rays or radiation is 10% by mass or more with respect to the total solid content of the composition, and
the acid-decomposable resin has a halogen atom in a repeating unit other than the repeating unit having a group that generates an acid upon irradiation with actinic rays or radiation.