An etching apparatus includes a conveyor, a spraying mechanism, a suction mechanism, and a controller. The conveyor is configured for conveying a substrate. The spraying mechanism includes a submersible pump and a number of spraying nozzles. The submersible pump selectively operates at an activated state where the spraying nozzles can spray etchant onto the substrate, or an unactivated state where the spraying nozzles cannot spray etchant. The suction mechanism includes a vacuum pump and a number of suction intakes. The vacuum pump selectively operates at an activated state where the suction intakes can suck up the etchant on the substrate, or an unactivated state where the suction intakes cannot suck up the etchant. The controller controls the pumps to operate alternately, so the vacuum pump is unactivated when the submersible pump is activated and vice versa.