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公开(公告)号：US20180188649A1
公开(公告)日：2018-07-05
申请号：US15691282
申请日：2017-08-30
发明人： CHEN-FENG YEN , CHANG-HUNG LEE , YI-FANG LIN , YEN-CHIN HSIAO , SHOU-JUI HSIANG , MAO-FENG HSU
摘要： A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.
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公开(公告)号：US11680138B2
公开(公告)日：2023-06-20
申请号：US17114988
申请日：2020-12-08
发明人： Kuan-Wei Lee , Szu-Hsiang Su , Shou-Jui Hsiang , Pei-Jung Wu , Wei-Hsin Huang
CPC分类号： C08G69/265 , C08G69/32 , C08J3/096 , C08J3/11 , C08J5/18 , C08L67/03 , C08K2201/005 , C08L2201/56 , C08L2203/16 , C08L2203/20 , C08L2205/12 , C08L2312/00
摘要： A polymer dispersion is disclosed. The polymer dispersion includes a liquid crystal polymer powder, a polyamide acid, and a solvent. A solid content of the polymer dispersion includes the liquid crystal polymer powder and the polyamide acid. The liquid crystal polymer powder has a mass ratio of 20% to 30% in the solid content. The polyamide acid has a mass ratio of 70% to 80% in the solid content. The polyamide acid is obtained by mixing two kinds of diamines and two kinds of dianhydrides together, causing the diamines and the dianhydrides to be polymerized with each other. Both two kinds of diamines and two kinds of dianhydrides comprise a liquid crystal structure and a flexible structure respectively. A method of preparing the polymer dispersion, and a method for preparing a polymer composite film using the polymer dispersion are also disclosed.
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公开(公告)号：US11524491B2
公开(公告)日：2022-12-13
申请号：US17107787
申请日：2020-11-30
发明人： Wei-Hsin Huang , Chi-Fei Huang , Szu-Hsiang Su , Shou-Jui Hsiang , Kuan-Wei Lee
IPC分类号： B32B27/28 , B29C53/56 , B32B37/02 , B29C53/00 , B29C53/16 , B32B38/10 , B32B38/00 , B32B37/20 , B29K105/00 , C08G73/10 , B29K79/00 , C08G69/32
摘要： A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.
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公开(公告)号：US20220002490A1
公开(公告)日：2022-01-06
申请号：US16990148
申请日：2020-08-11
发明人： KUAN-WEI LEE , SZU-HSIANG SU , SHOU-JUI HSIANG , PEI-JUNG WU , WEI-HSIN HUANG
摘要： A polyimide component being transparent includes a dianhydride monomer and a diamine monomer. The dianhydride monomer has an asymmetric structure. The dianhydride monomer has at least one first polar group and at least one side chain group. The first polar group is an ester group. A molecular structural formula of the side chain group is: The diamine monomer has an asymmetric structure and at least one second polar group. The second polar group is at least one of a nitrogen heterocycle and an ether group. The polyimide component is polymerized by the dianhydride monomer and the diamine monomer. The disclosure also relates to a polyimide film and a polyimide copper clad laminate.
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公开(公告)号：US09992873B2
公开(公告)日：2018-06-05
申请号：US14967907
申请日：2015-12-14
申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
发明人： Yu-Cheng Huang
IPC分类号： H05K3/02 , H05K1/18 , H05K1/02 , H05K3/00 , H05K3/30 , H05K3/46 , H05K3/04 , H05K3/20 , H05K3/06
CPC分类号： H05K1/181 , H05K1/0298 , H05K3/0038 , H05K3/0058 , H05K3/007 , H05K3/045 , H05K3/06 , H05K3/20 , H05K3/303 , H05K3/46 , H05K2203/025
摘要： A circuit board includes a dielectric layer, a first circuit layer, a second circuit layer and at least an electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located outsides the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths thereof gradually decreasing along the extension direction. A method for manufacturing the circuit board is also provided.
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公开(公告)号：US09905508B2
公开(公告)日：2018-02-27
申请号：US15693198
申请日：2017-08-31
发明人： Wei-Shuo Su
IPC分类号： H01L23/498 , H01L21/48 , H01L41/047 , H01L23/00
CPC分类号： H01L23/4985 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49866 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L41/0475 , H01L2224/0401 , H01L2224/131 , H01L2224/16227 , H01L2224/16237 , H01L2224/32225 , H01L2224/73204 , H01L2224/81192 , H01L2224/92125 , H01L2924/1431 , H01L2924/1434 , H01L2924/15311 , H01L2924/15313 , H01L2924/014 , H01L2924/00014
摘要： A chip packaging structure includes a flexible circuit board, a first built-up structure, a second built-up structure, and a first solder resist layer. The flexible circuit board defines a bent area and a laminated area. The flexible circuit board includes a first dielectric layer. The first dielectric layer includes a first conductive pattern, a bearing layer opposite to the first conductive pattern and corresponding to the laminated area. The first built-up structure is located on the first conductive pattern and corresponds to the laminated area, and includes a second dielectric layer and a second conductive pattern electrically connected with the first conductive pattern. The second built-up structure is located on the bearing layer and corresponds to the laminated area, and includes a third dielectric layer and a third conductive pattern electrically connected with the first conductive pattern. The first solder resist layer covers the second conductive pattern.
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公开(公告)号：US09485859B1
公开(公告)日：2016-11-01
申请号：US14859857
申请日：2015-09-21
申请人： FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , Zhen Ding Technology Co., Ltd.
发明人： Xian-Qin Hu , Fu-Yun Shen , Jian Luo , Ming-Jaan Ho , Yi-Qiang Zhuang
CPC分类号： H05K1/0219 , H01P3/003 , H01P3/085 , H01P11/003 , H05K1/024 , H05K1/189 , H05K3/4652 , H05K3/4697 , H05K2201/0154 , H05K2201/05 , H05K2201/0715 , H05K2201/09618 , H05K2201/09809
摘要： A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.
摘要翻译： 柔性电路板包括第一基底层，电路层，第二基底层和结合层。 电路层耦合到第一基极层的一侧，并且包括线性信号线，位于线性信号线的两个相对侧的两个接地线以及位于线性信号线和接地线之间的两个中空区域。 接合层将第二基底层耦合到电路层，并且限定对应于线性信号线的第一开口并与电路层的中空区域连通。 接合层和电路层的中空区域的第一开口协调地限定围绕线性信号线的空气介质层。 还提供了一种用于制造柔性电路板的方法。
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公开(公告)号：US09472426B2
公开(公告)日：2016-10-18
申请号：US14841721
申请日：2015-09-01
发明人： Wei-Shuo Su
IPC分类号： H01L21/48 , H01L21/768 , H01L23/498 , H01L21/683
CPC分类号： H01L21/4853 , H01L21/4828 , H01L21/4857 , H01L21/6835 , H01L21/76879 , H01L23/49822 , H01L2221/68318 , H01L2221/68345 , H01L2221/68377 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing a packaging substrate includes: patterning a first photo-resisting layer having first openings on a copper foil layer to expose portions of the copper foil layer; patterning a removable second photo-resisting layer having second openings on the first photo-resisting layer to expose the first openings; filling copper into the first and second openings to form base portions and a first wiring layer; orderly forming a first dielectric layer and a second wiring layer on the first wiring layer; patterning a removable third photo-resisting layer comprising covering portions opposite to the base portions on the copper foil layer; and etching the copper foil layer to form protruding portions connected to and corresponding to the base portions to define a copper pillar bump, a size of the copper pillar bump gradually increasing from the protruding portions to the base portions.
摘要翻译： 一种封装衬底的制造方法，包括：在铜箔层上形成具有第一开口部的第一耐光层，使铜箔层的部分露出; 图案化具有在第一光阻层上的第二开口的可移除的第二光阻层以暴露第一开口; 将铜填充到第一和第二开口中以形成基部和第一布线层; 在第一布线层上有序地形成第一电介质层和第二布线层; 图案化可移除的第三光阻层，其包括与铜箔层上的基部相对的覆盖部分; 并且蚀刻铜箔层以形成连接到基部并对应于基部的突出部分，以限定铜柱凸起，铜柱凸块的尺寸从突出部分逐渐增加到基部。
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9.发明授权Packaging substrate, method for manufacturing same, and chip packaging body having same 有权包装用基板及其制造方法以及具有该基板的芯片封装体公开(公告)号：US09357647B2
公开(公告)日：2016-05-31
申请号：US13971854
申请日：2013-08-21
发明人： Chu-Chin Hu , Shih-Ping Hsu , E-Tung Chou , Chih-Jen Hsiao
IPC分类号： H05K1/11 , H01L23/498 , H01L21/48 , H01L21/683 , H01L23/31 , H01L21/56 , H01L23/00
CPC分类号： H05K1/112 , H01L21/4853 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/49816 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2221/68345 , H01L2224/29011 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73104 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/05599 , H01L2924/00
摘要： A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads.
摘要翻译： 包装基板包括支撑片，铜箔，多个连接焊盘，多个焊球，树脂层，布线层和焊料掩模层。 铜箔通过粘合片附着在支撑片材的表面上。 连接焊盘形成在铜箔上。 焊球形成在连接焊盘上。 树脂层填充焊球之间的间隙。 布线层形成在树脂层和焊球上。 焊料球的背离连接焊盘的端子部分电连接到布线层。 在布线层上形成焊料掩模层。 焊接掩模层限定暴露部分布线层的多个开口。 通过开口露出的布线层的部分作为接触垫。
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公开(公告)号：US09277640B2
公开(公告)日：2016-03-01
申请号：US14586986
申请日：2014-12-31
发明人： Ming-Jaan Ho , Xian-Qin Hu , Fu-Yun Shen , Yi-Qiang Zhuang
CPC分类号： H05K1/0218 , H05K1/0219 , H05K1/0393 , H05K2201/0715 , H05K2201/09509 , Y10T156/1057
摘要： A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.
摘要翻译： 柔性印刷电路板包括柔性印刷电路单元和电磁屏蔽结构。 柔性印刷电路单元包括基底层和形成在基底层的表面上的第一电路层。 电磁屏蔽结构包括第一绝缘层和铜层。 第一绝缘层粘附在远离基层的第一电路层的表面上。 在电磁屏蔽结构中至少定义一个盲孔。 铜层通过填充在盲孔中的电镀结构电连接到第一电路层。
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