发明申请
- 专利标题: Removing Residues from Substrate Processing Components
- 专利标题(中): 从底物处理组件中除去残留物
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申请号: US13345317申请日: 2012-01-06
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公开(公告)号: US20120107520A1公开(公告)日: 2012-05-03
- 发明人: Brian T. West , Karl Brueckner , Shun Wu , Robert Haney
- 申请人: Brian T. West , Karl Brueckner , Shun Wu , Robert Haney
- 主分类号: B05D3/06
- IPC分类号: B05D3/06 ; B05D7/14 ; B05D3/10 ; B08B6/00 ; B08B5/00
摘要:
Residues are removed from a surface of a substrate processing component which has a polymer coating below the residues. In one version, the component surfaces are contacted with an organic solvent to remove the residues without damaging or removing the polymer coating. The residues can be process residues or adhesive residues. The cleaning process can be conducted as part of a refurbishment process. In another version, the residues are ablated by scanning a laser across the component surface. In yet another version, the residues are vaporized by scanning a plasma cutter across the surface of the component.
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