Invention Application
- Patent Title: CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS
- Patent Title (中): 具有高密度电路图形的电路板
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Application No.: US13354438Application Date: 2012-01-20
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Publication No.: US20120111607A1Publication Date: 2012-05-10
- Inventor: Shuhichi OKABE , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
- Applicant: Shuhichi OKABE , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0104203 20061025
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.
Public/Granted literature
- US08633392B2 Circuit board with high-density circuit patterns Public/Granted day:2014-01-21
Information query
