发明申请
- 专利标题: FLAME RETARDANT RESIN COMPOSITION FOR MULTILAYER WIRING BOARD AND MULTILAYER WIRING BOARD INCLUDING THE SAME
- 专利标题(中): 用于多层布线板和包括其的多层布线板的阻燃树脂组合物
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申请号: US13161760申请日: 2011-06-16
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公开(公告)号: US20120111618A1公开(公告)日: 2012-05-10
- 发明人: Hyung Mi Jung , Jae Choon Cho , Choon Keun Lee
- 申请人: Hyung Mi Jung , Jae Choon Cho , Choon Keun Lee
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 优先权: KR10-2010-0109967 20101105
- 主分类号: H05K1/02
- IPC分类号: H05K1/02 ; C08L63/04 ; C08L63/10 ; C08L63/00
摘要:
There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.
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