Invention Application
- Patent Title: THERMALLY EXPANDED MICROSPHERES AND A PROCESS FOR PRODUCING THE SAME
- Patent Title (中): 热膨胀微晶及其制造方法
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Application No.: US13355647Application Date: 2012-01-23
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Publication No.: US20120121907A1Publication Date: 2012-05-17
- Inventor: Toshiaki MASUDA , Ichiro TAKAHARA , Kenichi KITANO , Katsushi MIKI , Takeshi INOHARA , Takayuki AOKI
- Applicant: Toshiaki MASUDA , Ichiro TAKAHARA , Kenichi KITANO , Katsushi MIKI , Takeshi INOHARA , Takayuki AOKI
- Applicant Address: JP Osaka
- Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.
- Current Assignee Address: JP Osaka
- Priority: JP2005-303626 20050916
- Main IPC: B32B1/00
- IPC: B32B1/00 ; B32B5/16
Abstract:
The present invention provides heat-expanded microspheres having high packing efficiency, and a production method thereof. The heat-expanded microspheres are produced by expanding heat-expandable microspheres, which comprise shell of thermoplastic resin and a blowing agent encapsulated therein having a boiling point not higher than the softening point of the thermoplastic resin and have an average particle size from 1 to 100 micrometer, at a temperature not lower than their expansion initiating temperature, and the heat-expanded microspheres result in a void fraction not higher than 0.70.
Public/Granted literature
- US08486531B2 Thermally expanded microspheres and a process for producing the same Public/Granted day:2013-07-16
Information query
