发明申请
- 专利标题： APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE
- 专利标题（中）： 用于制造LED封装的装置和方法
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申请号： US13278887申请日： 2011-10-21
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公开(公告)号： US20120122250A1公开(公告)日： 2012-05-17
- 发明人: Won Soo JI , Choo Ho KIM , Sung Hoon OH , Min Hwan KIM , Beom Seok SHIN
- 申请人： Won Soo JI , Choo Ho KIM , Sung Hoon OH , Min Hwan KIM , Beom Seok SHIN
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG LED CO., LTD.
- 当前专利权人： SAMSUNG LED CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2010-0114128 20101116
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; B21B15/00
摘要：
An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.
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