公开(公告)号：US20120122250A1

公开(公告)日：2012-05-17

申请号：US13278887

申请日：2011-10-21

申请人： Won Soo JI ,  Choo Ho KIM ,  Sung Hoon OH ,  Min Hwan KIM ,  Beom Seok SHIN

发明人： Won Soo JI ,  Choo Ho KIM ,  Sung Hoon OH ,  Min Hwan KIM ,  Beom Seok SHIN

IPC分类号： H01L21/66 ,  B21B15/00

CPC分类号： H01L22/14 ,  G01R31/2601 ,  G01R31/2635 ,  H01L33/48 ,  H01L2933/0033 ,  H01L2933/005 ,  Y10T29/51

摘要： An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.

摘要翻译： 一种用于制造发光二极管（LED）封装的装置，包括：加热单元，其将引线框架状态中的LED封装阵列加热，其中安装多个LED封装件以阵列设置在引线框架上; 测试单元，通过向由加热单元加热的LED封装阵列施加电压或电流来测试LED封装阵列中的每个LED封装的工作状态; 以及切割单元，根据测试单元的测试结果，仅切断被确定为功能产品的LED封装或从引线框确定为缺陷产品的LED封装以将其去除。