发明申请
US20120122395A1 THROUGH CHIP COUPLING FOR SIGNAL TRANSPORT 有权
通过芯片耦合进行信号传输

THROUGH CHIP COUPLING FOR SIGNAL TRANSPORT
摘要:
Through-chip coupling is utilized for signal transport, where an interface is formed between a first coil on a first integrated circuit (IC) chip and a second coil on a second IC chip. The first coil is coupled to an antenna. The second coil is coupled to an amplifier circuit. The second coil is not in direct contact with the first coil. The first coil and the second coil communicatively transmit signals between the antenna and the first amplifier circuit.
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