发明申请
- 专利标题: THROUGH CHIP COUPLING FOR SIGNAL TRANSPORT
- 专利标题(中): 通过芯片耦合进行信号传输
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申请号: US12946072申请日: 2010-11-15
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公开(公告)号: US20120122395A1公开(公告)日: 2012-05-17
- 发明人: Tzu-Jin YEH , Hsieh-Hung HSIEH , Jun-De JIN , Ming Hsien TSAI , Chewn-Pu JOU , Fu-Lung HSUEH
- 申请人: Tzu-Jin YEH , Hsieh-Hung HSIEH , Jun-De JIN , Ming Hsien TSAI , Chewn-Pu JOU , Fu-Lung HSUEH
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H04B5/00
- IPC分类号: H04B5/00
摘要:
Through-chip coupling is utilized for signal transport, where an interface is formed between a first coil on a first integrated circuit (IC) chip and a second coil on a second IC chip. The first coil is coupled to an antenna. The second coil is coupled to an amplifier circuit. The second coil is not in direct contact with the first coil. The first coil and the second coil communicatively transmit signals between the antenna and the first amplifier circuit.
公开/授权文献
- US09397729B2 Through chip coupling for signal transport 公开/授权日:2016-07-19
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