发明申请
- 专利标题: ELECTRODE PLATE WRAPPING DEVICE AND METHOD OF WRAPPING ELECTRODE PLATE WITH SEPARATORS
- 专利标题(中): 电极板封装装置以及用隔离器包覆电极板的方法
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申请号: US13030169申请日: 2011-02-18
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公开(公告)号: US20120132697A1公开(公告)日: 2012-05-31
- 发明人: Yasuhiro YANO , Manabu YAMASHITA
- 申请人: Yasuhiro YANO , Manabu YAMASHITA
- 申请人地址: JP Kyoto-shi
- 专利权人: KYOTO SEISAKUSHO CO., LTD.
- 当前专利权人: KYOTO SEISAKUSHO CO., LTD.
- 当前专利权人地址: JP Kyoto-shi
- 优先权: JP2010-262748 20101125
- 主分类号: B23K31/02
- IPC分类号: B23K31/02 ; B23K31/12 ; B23K37/04
摘要:
In some examples, an electrode plate K is conveyed to a gap 230 of a pair of stacking drums 210 and 220 with a conveying section 100. In synchronization with conveyance of the electrode plate K, the drums 210 and 220 feed a pair of separators S each formed into a predetermined shape with the separators S adhering to corresponding peripheral surfaces of the pair of drums 210 and 220. While feeding the electrode plate K forward in a generally horizontal manner, the separators S are sequentially stacked on both surfaces of the electrode plate K in synchronized with rotations of the drums 210 and 220, and both edge portions of the separators S are welded.
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