Invention Application
- Patent Title: Semiconductor Devices Having Electrodes and Methods of Fabricating the Same
- Patent Title (中): 具有电极的半导体器件及其制造方法
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Application No.: US13303255Application Date: 2011-11-23
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Publication No.: US20120133041A1Publication Date: 2012-05-31
- Inventor: Jae-hyun Phee , Uihyouong Lee , Ju-il Choi , Jung-Hwan Kim
- Applicant: Jae-hyun Phee , Uihyouong Lee , Ju-il Choi , Jung-Hwan Kim
- Priority: KR10-2010-0118960 20101126
- Main IPC: H01L23/498
- IPC: H01L23/498

Abstract:
Some embodiments provide a semiconductor device including a substrate having a first surface and an opposite second surface. An electrode extends within the substrate towards the first surface and has a protruding portion extending from the first surface. A supporting portion extends from the first surface of the substrate to a sidewall of the protruding portion that supports the protruding portion. Methods of fabricating the same are also provided.
Public/Granted literature
- US08575760B2 Semiconductor devices having electrodes Public/Granted day:2013-11-05
Information query
IPC分类: