发明申请
US20120139094A1 STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIVE CHIPS
有权
具有连接主动插座的插座的堆叠式微电子组件
- 专利标题: STACKED MICROELECTRONIC ASSEMBLY HAVING INTERPOSER CONNECTING ACTIVE CHIPS
- 专利标题(中): 具有连接主动插座的插座的堆叠式微电子组件
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申请号: US12958866申请日: 2010-12-02
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公开(公告)号: US20120139094A1公开(公告)日: 2012-06-07
- 发明人: Belgacem Haba , Vage Oganesian , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
- 申请人: Belgacem Haba , Vage Oganesian , Ilyas Mohammed , Piyush Savalia , Craig Mitchell
- 申请人地址: US CA San Jose
- 专利权人: TESSERA RESEARCH LLC
- 当前专利权人: TESSERA RESEARCH LLC
- 当前专利权人地址: US CA San Jose
- 主分类号: H01L29/41
- IPC分类号: H01L29/41 ; H01L21/44
摘要:
A microelectronic assembly can include first and second microelectronic elements each embodying active semiconductor devices adjacent a front surface thereof, and having an electrically conductive pad exposed at the respective front surface. An interposer of material having a CTE less than 10 ppm/° C. has first and second surfaces attached to the front surfaces of the respective first and second microelectronic elements, the interposer having a second conductive element extending within an opening in the interposer. First and second conductive elements extend within openings extending from the rear surface of a respective microelectronic element of the first and second microelectronic elements towards the front surface of the respective microelectronic element. In one example, one or more of the first or second conductive elements extends through the respective first or second pad, and the conductive elements contact the exposed portions of the second conductive element to provide electrical connection therewith.
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