公开(公告)号：US09233511B2

公开(公告)日：2016-01-12

申请号：US13468632

申请日：2012-05-10

Applicant: Vage Oganesian ,  Zhenhua Lu

Inventor： Vage Oganesian ,  Zhenhua Lu

IPC: B29D11/00

CPC classification number: B29D11/00403

Abstract: A method of forming lenses includes providing a lens handler having a plurality of cavities formed into an upper surface thereof. For each of the cavities, the method includes dispensing a first polymer material into the cavity, pressing a non-planar stamp surface onto the first polymer material wherein an upper surface of the first polymer material is conformed to the non-planar stamp surface, and applying UV light to the first polymer material to cure the first polymer material. A dispenser carrier can be used that includes a plurality of liquid polymer dispensers. A stamp carrier can be used that includes a plurality of stamps each having a non-planar stamp surface. Alternately, a stamp handler having a plurality of stamps arranged along a curved surface can be used to roll along the polymer material such that an upper surface thereof conforms to the non-planar stamp surfaces.

Abstract translation: 一种形成透镜的方法包括提供具有形成在其上表面中的多个空腔的透镜处理器。 对于每个空腔，所述方法包括将第一聚合物材料分配到空腔中，将非平面印模表面压在第一聚合物材料上，其中第一聚合物材料的上表面与非平面印模表面一致，以及 将UV光施加到第一聚合物材料以固化第一聚合物材料。 可以使用包括多个液体聚合物分配器的分配器载体。 可以使用包括多个具有非平面印记表面的印章的邮票载体。 或者，可以使用具有沿着曲面布置的多个邮票的邮票处理器沿着聚合物材料滚动，使得其上表面符合非平面印记表面。

公开(公告)号：US09125333B2

公开(公告)日：2015-09-01

申请号：US13183870

申请日：2011-07-15

Applicant: Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

Inventor： Cyprian Uzoh ,  Vage Oganesian ,  Ilyas Mohammed ,  Belgacem Haba ,  Piyush Savalia ,  Craig Mitchell

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/40

CPC classification number: H01L24/05 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05169 ,  H01L2224/056 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01074 ,  H01L2924/013 ,  H05K1/09 ,  H05K3/4007 ,  H05K2201/032 ,  H05K2201/0326 ,  H05K2201/0338

Abstract: Barrier layers for use in electrical applications. In some embodiments the barrier layer is a laminated barrier layer. In some embodiments the barrier layer includes a graded barrier layer.

Abstract translation: 用于电气应用的阻隔层。 在一些实施例中，阻挡层是层压阻挡层。 在一些实施例中，阻挡层包括梯度阻挡层。

公开(公告)号：US08937361B2

公开(公告)日：2015-01-20

申请号：US13114243

申请日：2011-05-24

Applicant: Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

Inventor： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC: H01L31/0232 ,  H01L27/146

CPC classification number: H01L27/14625 ,  H01L27/1461 ,  H01L27/14629 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687

Abstract: A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face such that the first and second light sensing elements receive light of substantially the same intensity. A dielectric region is provided at least substantially filling a space of the semiconductor region adjacent at least one of the light sensing elements. The dielectric region may include at least one light guide.

Abstract translation: 提供了一种用于背面照明的微电子图像传感器组件及其制造方法。 该组件包括具有在正面暴露的触点的微电子元件和被布置成通过后表面接收不同波长的光的光感测元件。 半导体区域在第一光感测元件和后表面之间具有第一厚度，并且在第二光感测元件和后表面之间具有第二厚度，使得第一和第二光感测元件接收基本上相同强度的光。 提供至少基本上填充与至少一个光感测元件相邻的半导体区域的空间的电介质区域。 电介质区域可以包括至少一个光导。

公开(公告)号：US08796800B2

公开(公告)日：2014-08-05

申请号：US13301683

申请日：2011-11-21

Applicant: Vage Oganesian

Inventor： Vage Oganesian

IPC: H01L31/02

CPC classification number: H01L31/18 ,  H01L27/14618 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image sensor package and method of manufacture that includes a crystalline handler with conductive elements extending therethrough, an image sensor chip disposed in a cavity of the handler, and a transparent substrate disposed over the cavity and bonded to both the handler and image sensor chip. The transparent substrate includes conductive traces that electrically connect the sensor chip's contact pads to the handler's conductive elements, so that off-chip signaling is provided by the substrate's conductive traces and the handler's conductive elements.

Abstract translation: 一种图像传感器封装及其制造方法，其包括具有延伸穿过其中的导电元件的结晶处理器，设置在处理器的空腔中的图像传感器芯片，以及设置在空腔上方并结合到处理器和图像传感器芯片两者上的透明基板。 透明基板包括将传感器芯片的接触焊盘电连接到处理器的导电元件的导电迹线，使得片外信令由衬底的导电迹线和处理器的导电元件提供。

公开(公告)号：US08652935B2

公开(公告)日：2014-02-18

申请号：US12970529

申请日：2010-12-16

Applicant: Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell ,  Vage Oganesian ,  Belgacem Haba

Inventor： Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell ,  Vage Oganesian ,  Belgacem Haba

IPC: H01L21/30

CPC classification number: H01L23/562 ,  B81C1/00269 ,  B81C1/00357 ,  H01L21/2007 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/13 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83345 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of bonding first and second microelectronic elements includes pressing together a first substrate containing active circuit elements therein with a second substrate, with a flowable dielectric material between confronting surfaces of the respective substrates, each of the first and second substrates having a coefficient of thermal expansion less than 10 parts per million/° C., at least one of the confronting surfaces having a plurality of channels extending from an edge of such surface, such that the dielectric material between planes defined by the confronting surfaces is at least substantially free of voids and has a thickness over one micron, and at least some of the dielectric material flows into at least some of the channels.

Abstract translation: 接合第一和第二微电子元件的方法包括将含有有源电路元件的第一衬底与第二衬底压在一起，在相应衬底的相对表面之间具有可流动介电材料，第一和第二衬底中的每一个具有热系数 膨胀小于10ppm /℃，至少一个相对表面具有从该表面的边缘延伸的多个通道，使得由相对表面限定的平面之间的电介质材料至少基本上不含 空隙并且具有超过一微米的厚度，并且至少一些介电材料流入至少一些通道。

公开(公告)号：US08610259B2

公开(公告)日：2013-12-17

申请号：US12884695

申请日：2010-09-17

Applicant: Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

Inventor： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC: H01L23/48

CPC classification number: H01L23/49827 ,  H01L21/6835 ,  H01L23/481 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2223/6622 ,  H01L2224/05009 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/0557 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A microelectronic unit includes a semiconductor element consisting essentially of semiconductor material and having a front surface, a rear surface, a plurality of active semiconductor devices adjacent the front surface, a plurality of conductive pads exposed at the front surface, and an opening extending through the semiconductor element. At least one of the conductive pads can at least partially overlie the opening and can be electrically connected with at least one of the active semiconductor devices. The microelectronic unit can also include a first conductive element exposed at the rear surface for connection with an external component, the first conductive element extending through the opening and electrically connected with the at least one conductive pad, and a second conductive element extending through the opening and insulated from the first conductive element. The at least one conductive pad can overlie a peripheral edge of the second conductive element.

Abstract translation: 微电子单元包括基本上由半导体材料组成的半导体元件，其具有前表面，后表面，与前表面相邻的多个有源半导体器件，在前表面暴露的多个导电焊盘，以及延伸穿过 半导体元件。 至少一个导电焊盘可以至少部分地覆盖开口并且可以与至少一个有源半导体器件电连接。 微电子单元还可以包括暴露在后表面处以与外部部件连接的第一导电元件，第一导电元件延伸穿过开口并与至少一个导电焊盘电连接，第二导电元件延伸穿过开口 并与第一导电元件绝缘。 至少一个导电焊盘可以覆盖在第二导电元件的周边边缘上。

公开(公告)号：US08569876B2

公开(公告)日：2013-10-29

申请号：US11603935

申请日：2006-11-22

Applicant: Andrey Grinman ,  David Ovrutsky ,  Charles Rosenstein ,  Vage Oganesian

Inventor： Andrey Grinman ,  David Ovrutsky ,  Charles Rosenstein ,  Vage Oganesian

IPC: H01L23/50

CPC classification number: H01L23/3128 ,  H01L23/29 ,  H01L23/3114 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/556 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16148 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1058 ,  H01L2225/1064 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/1436 ,  H01L2924/3025 ,  H01L2924/00

Abstract: A chip-sized, wafer level packaged device including a portion of a semiconductor wafer including a device, at least one packaging layer containing silicon and formed over the device, a first ball grid array formed over a surface of the at least one packaging layer and being electrically connected to the device and a second ball grid array formed over a surface of the portion of the semiconductor wafer and being electrically connected to the device.

公开(公告)号：US20130249031A1

公开(公告)日：2013-09-26

申请号：US13427604

申请日：2012-03-22

Applicant: Vage Oganesian

Inventor： Vage Oganesian

IPC: H01L27/146

CPC classification number: H01L27/14627 ,  H01L27/14621 ,  H01L27/1464 ,  H01L27/14647 ,  H01L27/14685

Abstract: An image sensor device (and method of making same) that includes a substrate with front and back opposing surfaces, a plurality of photo detectors formed at the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors. A plurality of cavities are formed into a back surface of the substrate such that each cavity is disposed over one of the photo detectors. Absorption compensation material having light absorption characteristics that differ from those of the substrate is disposed in the cavities. A plurality of color filters are each disposed over one of the photo detectors. The plurality of photo detectors are configured to produce electronic signals in response to light incident through the color filters.

Abstract translation: 一种图像传感器装置（及其制造方法），其包括具有前后相对表面的基板，形成在前表面处的多个光电检测器和形成在前表面处的多个接触焊盘，其被电耦合到 光电探测器 多个空腔形成在基板的后表面中，使得每个空腔设置在一个光电检测器上。 具有与基板不同的光吸收特性的吸收补偿材料设置在空腔中。 多个滤色器分别设置在一个光检测器上。 多个光电检测器被配置为响应于通过滤色器入射的光而产生电子信号。

公开(公告)号：US20130242155A1

公开(公告)日：2013-09-19

申请号：US13423045

申请日：2012-03-16

Applicant: Vage Oganesian

Inventor： Vage Oganesian

IPC: H04N5/374

CPC classification number: H04N5/374 ,  H01L24/05 ,  H01L27/14605 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/1464 ,  H01L27/14687 ,  H01L2224/04042 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image sensor device that includes a substrate and a plurality of color filters. The substrate includes a plurality of photo detectors (wherein a first portion of the plurality of photo detectors each has a lateral size that is smaller than that of each of a second portion of the plurality of photo detectors) and a plurality of contact pads which are electrically coupled to the photo detectors. The plurality of color filters are each disposed over one of the photo detectors. The plurality of photo detectors are configured to produce electronic signals in response to light incident through the color filters. A third portion of the plurality of photo detectors are laterally disposed between the first and second portions of the photo detectors, and each having a lateral size between those of the first and second portions of the photo detectors.

Abstract translation: 一种包括基板和多个滤色器的图像传感器装置。 基板包括多个光电检测器（其中多个光电检测器的第一部分各自具有小于多个光电检测器的第二部分中的每一个的横向尺寸）和多个接触焊盘 电耦合到光电检测器。 多个滤色器分别设置在一个光检测器上。 多个光电检测器被配置为响应于通过滤色器入射的光而产生电子信号。 多个光电检测器的第三部分横向设置在光电检测器的第一和第二部分之间，并且每个具有在光电检测器的第一和第二部分之间的横向尺寸。

公开(公告)号：US08512491B2

公开(公告)日：2013-08-20

申请号：US12974611

申请日：2010-12-21

Applicant: Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

Inventor： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia ,  Craig Mitchell

IPC: B32B41/00

CPC classification number: H01L22/12 ,  H01L21/67092

Abstract: A method of bonding a first substrate and a second substrate includes the steps of rotating first substrate with an adhesive mass thereon, and second substrate contacting the mass and overlying the first substrate, controlling a vertical height of a heated control platen spaced apart from and not contacting the second substrate so as to control a temperature of the adhesive mass, so as to at least one of bond the first and second substrates in alignment with one another, or achieve a sufficiently planar adhesive interface between the first and second substrates.

Abstract translation: 接合第一基板和第二基板的方法包括以下步骤：使第一基板与其上的粘合剂质量物质旋转，第二基板接触物料并覆盖第一基板，控制加热的控制台板的垂直高度， 使所述第二基板接触以控制所述粘合剂物料的温度，以便使所述第一和第二基板彼此对准的至少一个接合，或在所述第一和第二基板之间实现足够平坦的粘合界面。