发明申请
- 专利标题： PROCESSING ASSEMBLY FOR SEMICONDUCTOR WORKPIECE AND METHODS OF PROCESSING SAME
- 专利标题（中）： 半导体工件的加工组件及其加工方法
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申请号： US12960372申请日： 2010-12-03
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公开(公告)号： US20120142196A1公开(公告)日： 2012-06-07
- 发明人: Jason Rye , Kyle M. Hanson
- 申请人： Jason Rye , Kyle M. Hanson
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; B05D5/12
摘要：
A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.
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