Invention Application
- Patent Title: Thermal Impedance Matching Using Common Materials
- Patent Title (中): 使用普通材料的热阻匹配
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Application No.: US13364713Application Date: 2012-02-02
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Publication No.: US20120145375A1Publication Date: 2012-06-14
- Inventor: Denny D. Beasley
- Applicant: Denny D. Beasley
- Applicant Address: US IL Blue Island
- Assignee: ROBERTSON TRANSFORMER CO.
- Current Assignee: ROBERTSON TRANSFORMER CO.
- Current Assignee Address: US IL Blue Island
- Main IPC: F28F27/00
- IPC: F28F27/00 ; F28F21/00

Abstract:
A device and method for dissipating heat from a source of heat is described. A plurality of layers of thermally conductive materials receives a flow of heat from a source of heat. A first layer of the plurality of layers receives the flow of heat from the source of heat and redirects and transfers the flow of heat to a second of the plurality of layers. Each layer has a separate preselected thermal impedance to control a desired temperature change across the plurality of layers and to maintain a desired operating temperature of the source heat.
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