发明申请
US20120152604A1 MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTI-LAYERED CERAMIC CAPACITOR, METHOD THEREOF, LAND PATTERN OF CIRCUIT BOARD FOR THE SAME, PACKING UNIT FOR MULTI-LAYERED CERAMIC CAPACITOR TAPED HORIZONTALLY AND ALIGNING METHOD THEREOF
审中-公开
具有多层陶瓷电容器的电路板的安装结构，其方法，电路板的土地图案，多层陶瓷电容器的包装单元和水平方法
- 专利标题： MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTI-LAYERED CERAMIC CAPACITOR, METHOD THEREOF, LAND PATTERN OF CIRCUIT BOARD FOR THE SAME, PACKING UNIT FOR MULTI-LAYERED CERAMIC CAPACITOR TAPED HORIZONTALLY AND ALIGNING METHOD THEREOF
- 专利标题（中）： 具有多层陶瓷电容器的电路板的安装结构，其方法，电路板的土地图案，多层陶瓷电容器的包装单元和水平方法
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申请号： US13331619申请日： 2011-12-20
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公开(公告)号： US20120152604A1公开(公告)日： 2012-06-21
- 发明人: Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
- 申请人： Young Ghyu Ahn , Byoung Hwa Lee , Min Cheol Park , Sang Soo Park , Dong Seok Park
- 申请人地址： KR Suwon
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2010-0131716 20101221
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K3/00 ; H01G4/30
摘要：
The present invention provides a method of mounting a circuit board having thereon a multi-layered ceramic capacitor and a land pattern of a circuit board for the same. The method of mounting a circuit board having thereon a multi-layered ceramic capacitor on which a plurality of dielectric sheet having internal electrodes formed thereon are stacked and the external terminal electrodes connected to the internal electrodes in parallel are formed on both ends thereof includes conductively connecting lands of a circuit board to the external terminal electrodes in such a way that internal electrode layers of the multi-layered ceramic capacitor and the circuit board are arranged in a horizontal direction, wherein a height TS of conductive material to conductively connect the external terminal electrodes to the lands is less than ⅓ of a thickness TMLCC of the multi-layered ceramic capacitor.