发明申请
- 专利标题： SOLID-STATE IMAGE PICKUP DEVICE
- 专利标题（中）： 固态图像拾取器件
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申请号： US13333609申请日： 2011-12-21
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公开(公告)号： US20120161267A1公开(公告)日： 2012-06-28
- 发明人: Takayuki Ezaki , Teruo Hirayama
- 申请人： Takayuki Ezaki , Teruo Hirayama
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-028353 20040204
- 主分类号： H01L31/02
- IPC分类号： H01L31/02
摘要：
A solid-state image pickup device 1 according to the present invention includes a semiconductor substrate 2 on which a pixel 20 composed of a photodiode 3 and a transistor is formed. The transistor comprising the pixel 20 is formed on the surface of the semiconductor substrate, a pn junction portion formed between high concentration regions of the photodiode 3 is provided within the semiconductor substrate 2 and a part of the pn junction portion of the photodiode 3 is extended to a lower portion of the transistor formed on the surface of the semiconductor substrate 2. According to the present invention, there is provided a solid-state image pickup device in which a pixel size can be microminiaturized without lowering a saturated electric charge amount (Qs) and sensitivity.
公开/授权文献
- US08445944B2 Solid-state image pickup device 公开/授权日：2013-05-21
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