Invention Application
- Patent Title: SURFACE ALLOY PROCESS FOR MEMS AND NEMS
- Patent Title (中): 用于MEMS和NEMS的表面合金工艺
-
Application No.: US12979160Application Date: 2010-12-27
-
Publication No.: US20120161573A1Publication Date: 2012-06-28
- Inventor: Ming Fang
- Applicant: Ming Fang
- Applicant Address: US TX Carrollton
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Carrollton
- Main IPC: H02N1/00
- IPC: H02N1/00 ; B05D5/12
Abstract:
A method of manufacturing microstructures, such as MEMS or NEMS devices, including forming a protective layer on a surface of a moveable component of the microstructure. For example, a silicide layer may be formed on one or more surfaces of a poly-silicon mass that is moveable with respect to a substrate of the microstructure. The process may be self-aligning.
Public/Granted literature
- US09174835B2 Microstructure and electronic device Public/Granted day:2015-11-03
Information query
