A light emitting diode package module includes a printed circuit board, a wiring film and light emitting diode packages. The printed circuit board includes first regions and second regions, which are alternately disposed. The wiring film is disposed over the printed circuit board and includes first sections and second sections, which are alternately disposed. Each diode package is disposed between one of the first regions and one of the first sections. The light emitting diode package is electrically connected to the wiring film. The second sections and the second regions are adhered to each other so that the wiring film and the printed circuit board are electrically connected.